Active thermal cycle reduction of power modules via gate resistance manipulation

Broeck, Christoph H. van der; Ruppert, Lukas A.; Lorenz, Robert D.; Doncker, Rik W. De

doi:10.1109/apec.2018.8341539

Cited by 30 publications

(9 citation statements)

References 17 publications

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“…Therefore, a dynamic power steering in Case B and C depending on RSS demand and power factor can be beneficial. A competing objective of active power steering in the parallel ac-dc link system could be to decrease the thermal cycling at the junction of the dc link converter switches to improve the reliability of power electronic components [31], [32]. However, increasing or decreasing the ac link power share in order to minimize the dc link converter thermal cycling can move the system away from the optimal efficiency point.…”

Section: Operational Opportunitiesmentioning

confidence: 99%

Reliability, Efficiency and Cost Trade-offs for Medium Voltage Distribution Network Expansion using Refurbished AC-DC Reconfigurable Links

Shekhar

Ramírez-Elizondo

Bauer

2018

2018 International Symposium on Power Electronics, Electrical Drives, Automation and Motion (SPEEDAM)

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The role of MVDC links for distribution network expansion is important. The distribution network operators (DNOs) can maximize the power transfer capacity of existing grid infrastructure during (n-1) contingencies using reconfigurable parallel ac-dc architecture. In addition this concept involves a range of efficiency, reliability and economic trade-offs. The object of this paper is to present a discussion on the emerging choices involved in adopting a parallel ac-dc reconfigurable link architecture in designing future and flexible power grids.

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Section: Operational Opportunitiesmentioning

confidence: 99%

Reliability, Efficiency and Cost Trade-offs for Medium Voltage Distribution Network Expansion using Refurbished AC-DC Reconfigurable Links

Shekhar

Ramírez-Elizondo

Bauer

2018

2018 International Symposium on Power Electronics, Electrical Drives, Automation and Motion (SPEEDAM)

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“…Infrared imaging using IRC is the early optical-based technique for capturing surface temperature distribution. In addition, IRC is still serving as a secondary measuring tool in most applications where other techniques are used for validation, thanks to its ability to quickly map the temperature distribution of a target surface from a distance [ 17 ]. The discovery of luminescence characteristics of semiconductors in forward bias in the 1990s was the primary drive behind the exploitation of TSOP for semiconductor switching devices.…”

Section: Introductionmentioning

confidence: 99%

Junction Temperature Optical Sensing Techniques for Power Switching Semiconductors: A Review

Isa,

Mirza,

Ghafoor

et al. 2023

Micromachines

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Recent advancements in power electronic switches provide effective control and operational stability of power grid systems. Junction temperature is a crucial parameter of power-switching semiconductor devices, which needs monitoring to facilitate reliable operation and thermal control of power electronics circuits and ensure reliable performance. Over the years, various junction temperature measurement techniques have been developed, engaging both non-optical and optical-based methods, highlighting their advancements and challenges. This review focuses on several optical sensing-based junction temperature measuring techniques used for power-switching devices such as metal-oxide-semiconductor field-effect transistors (MOSFETs) and insulated-gate bipolar transistors (IGBTs). A comprehensive summary of recent developments in infrared camera (IRC), thermal sensitive optical parameter (TSOP), and fiber Bragg grating (FBG) temperature sensing techniques is provided, shedding light on their merits and challenges while providing a few possible future solutions. In addition, calibration methods and remedies for obtaining accurate measurements are discussed, thus providing better insight and directions for future research.

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“…The resulting switching device loss and temperature fluctuations expedite bond-wire lift-off and solder delamination, which are major failure modes in power semiconductor This work is funded by the Research Council of Norway under the FRIPRO grant 287820 "Adaptive Silicon Carbide Electrical Energy Conversion Technologies for Medium Voltage Direct Current Grids (ASiCC)". devices [3]. Active Temperature Control (ATC) can reduce the amplitude of temperature stress cycles and thereby improve device reliability and lifetime [4], [5].…”

Section: Introductionmentioning

confidence: 99%

Four Level Voltage Active Gate Driver for Loss and Slope Control in SiC MOSFETs

Ekren

Philipps

Rodal

et al. 2022

2022 IEEE 13th International Symposium on Power Electronics for Distributed Generation Systems (PEDG)

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Silicon Carbide power semiconductors exhibit fast dynamic behavior. This facilitates the design of high efficiency and high power density converters. However, the resulting current and voltage changing rates demand extensive filtering to avoid electromagnetic interference and ensure safe operation. In addition, temperature fluctuations due to varying load currents from renewable energy sources pose challenges for power semiconductor device lifetime and reliability. Active temperature control can reduce temperature fluctuations, but affects switching slopes simultaneously. This leads to variable electrical stress on both device and circuit level. In this paper, a four-level active voltage-source gate driver for SiC MOSFETs is proposed, enabling manipulation of switching and conduction losses. Switching losses are manipulated by controlling the duration as well as amplitude of intermediate gate voltage pulses during switching transients. Conduction losses can be influenced by adjusting the positive gate voltage. Simulations indicate that the proposed gate driver allows decoupling switching loss and slope control. To validate the gate driver concept, a prototype has been built and evaluated in double pulse test experiments.

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Active thermal cycle reduction of power modules via gate resistance manipulation

Cited by 30 publications

References 17 publications

Reliability, Efficiency and Cost Trade-offs for Medium Voltage Distribution Network Expansion using Refurbished AC-DC Reconfigurable Links

Reliability, Efficiency and Cost Trade-offs for Medium Voltage Distribution Network Expansion using Refurbished AC-DC Reconfigurable Links

Junction Temperature Optical Sensing Techniques for Power Switching Semiconductors: A Review

Four Level Voltage Active Gate Driver for Loss and Slope Control in SiC MOSFETs

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