Additive interconnect fabrication by picosecond Laser Induced Forward Transfer

Oosterhuis, G.J.E.; Veld, Bert Huis in't; Ebberink, Gerald; Cerro, Daniel Arnaldo del; Eijnden, Edwin van den; Chall, P.; Zon, Ben van der

doi:10.1109/3dic.2010.5751481

Cited by 3 publications

(3 citation statements)

References 3 publications

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“…For the purposes of the reported work, a novel process for the laser transfer of solid pixels (comprising Ag NWs), exploiting thermal effects of laser irradiated pixels, has been developed. The process concept relies on Laser Induced Forward Transfer, as reported in previous articles published by the authors [ 27 , 28 ] or other groups [ 31 , 32 , 33 , 34 , 35 , 36 ], but has several key modifications which enable the intact transfer of solid pixels with well-defined geometrical shapes solely on polymeric and optically transparent substrates. The experimental configuration of the current process involves Laser Transfer from a solid donor layer comprising Ag NWs networks coated in ink form on a donor substrate, and a polymeric PEN receiving substrate with high optical transparency.…”

Section: Resultsmentioning

confidence: 99%

Single Step Laser Transfer and Laser Curing of Ag NanoWires: A Digital Process for the Fabrication of Flexible and Transparent Microelectrodes

et al. 2018

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Ag nanowire (NW) networks have exquisite optical and electrical properties which make them ideal candidate materials for flexible transparent conductive electrodes. Despite the compatibility of Ag NW networks with laser processing, few demonstrations of laser fabricated Ag NW based components currently exist. In this work, we report on a novel single step laser transferring and laser curing process of micrometer sized pixels of Ag NW networks on flexible substrates. This process relies on the selective laser heating of the Ag NWs induced by the laser pulse energy and the subsequent localized melting of the polymeric substrate. We demonstrate that a single laser pulse can induce both transfer and curing of the Ag NW network. The feasibility of the process is confirmed experimentally and validated by Finite Element Analysis simulations, which indicate that selective heating is carried out within a submicron-sized heat affected zone. The resulting structures can be utilized as fully functional flexible transparent electrodes with figures of merit even higher than 100. Low sheet resistance (<50 Ohm/sq) and high visible light transparency (>90%) make the reported process highly desirable for a variety of applications, including selective heating or annealing of nanocomposite materials and laser processing of nanostructured materials on a large variety of optically transparent substrates, such as Polydimethylsiloxane (PDMS).

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Section: Resultsmentioning

confidence: 99%

Single Step Laser Transfer and Laser Curing of Ag NanoWires: A Digital Process for the Fabrication of Flexible and Transparent Microelectrodes

et al. 2018

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“…For sensitive materials such as biological donors, it has been shown that it is possible to maintain the viability of these materials during LIFT [10,11]. When LIFT printing conductive lines, the material transferred showed an increase in resistivity for gold [12] and copper [13] when compared to the metals' respective bulk values. In a recent study, the multilayer LIFTing of light-emitting diodes (LEDs) showed degradation after LIFT due to contamination during the process for some of the LEDs.…”

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confidence: 99%

Laser-induced forward transfer of intact chalcogenide thin films: resultant morphology and thermoelectric properties

et al. 2012

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We present a laser-based transfer method for the novel application of fabricating elements for planar thermoelectric devices. Thin films of thermoelectric chalcogenides (Bi 2 Te 3 , Bi 2 Se 3 and Bi 0.5 Sb 1.5 Te 3 ) were printed via laserinduced forward transfer (LIFT) onto polymer-coated substrates over large areas of up to ∼15 mm 2 in size. A morphological study showed that it was possible to partially preserve the polycrystalline structure of the transferred films. The films' Seebeck coefficients after LIFT transfer were measured and resulted in −49 ± 1 µV/K, −93 ± 8 µV/K and 142 ± 3 µV/K for Bi 2 Te 3 , Bi 2 Se 3 and Bi 0.5 Sb 1.5 Te 3 , respectively, which were found to be ∼23 ± 6 % lower compared to their initial values. This demonstration shows that LIFT is suitable to transfer sensitive, functional semiconductor materials over areas up to ∼15 mm 2 with minimal damage onto a non-standard polymer-coated substrate. IntroductionThe deposition of complex materials for the fabrication of energy-harvesting microgenerator devices is of great interest for remote sensing [1] and waste-energy recovery [2]. As a consequence methods for device fabrication need to M. Feinaeugle ( ) •

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“…What is needed is a scheme of donor replenishment, whereby fresh donor can be supplied to fill in gaps within the previously printed regions, thereby ensuring continuous features with the correct amount of infill and overlap. Oosterhuis et al [23] have demonstrated the fabrication of 1 cm long, ~20 µm wide and over 1 µm high copper wires using picosecond LIFT. In this work, we demonstrate the fabrication of millimeter long wires with few micron-scale width and submicron scale height using femtosecond LIFT.…”

Section: Introductionmentioning

confidence: 99%

Micron-scale copper wires printed using femtosecond laser-induced forward transfer with automated donor replenishment

Grant-Jacob¹,

Mills²,

Feinaeugle³

et al. 2013

Opt. Mater. Express

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Abstract:We demonstrate the use of laser-induced forward transfer (LIFT) in combination with a novel donor replenishment scheme to print continuous copper wires. Wires of mm length, a few microns wide and submicron in height have been printed using a 800 nm, 1 kHz repetition rate, 150 fs pulsed laser. A 120 nm thick copper donor was used along with laser pulse energy densities of 0.16-0.21 J cm −2 to print overlapping few-micron sized pads to form the millimeter long wires. The wires have a measured resistivity of 17 ± 4 times that of bulk copper.

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Additive interconnect fabrication by picosecond Laser Induced Forward Transfer

Cited by 3 publications

References 3 publications

Single Step Laser Transfer and Laser Curing of Ag NanoWires: A Digital Process for the Fabrication of Flexible and Transparent Microelectrodes

Single Step Laser Transfer and Laser Curing of Ag NanoWires: A Digital Process for the Fabrication of Flexible and Transparent Microelectrodes

Laser-induced forward transfer of intact chalcogenide thin films: resultant morphology and thermoelectric properties

Micron-scale copper wires printed using femtosecond laser-induced forward transfer with automated donor replenishment

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