“…To challenge the above issues additive manufacturing (AM) technologies have been proposed as an alternative for the production of various high-frequency electronic circuits [12], [13], [14], [15]. WG components in such a scheme can be printed out of nonconductive material using, e.g., stereolithography process (SLA) [16], [17], [18], fused filament deposition (FFD) [19], [20], and polyjet printing [21], [22], [23]. Nevertheless, such approaches require an additional fabrication step, during which the 3-D-printed plastic components are metal coated.…”