2023
DOI: 10.1039/d2tc04183a
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Additive manufacturing of polyaniline blends for lightweight structures with tunable conductivity

Abstract: Printable feedstocks that can produce lightweight, robust, and ductile structures with tunable and switchable conductivity are of considerable interest for numerous application spaces.

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Cited by 7 publications
(2 citation statements)
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References 48 publications
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“…For example, PANI can be co-dissolved with camphor or aryl sulfonic acids as well as, optionally, insulating polymers such as poly(methyl methacrylate) (PMMA), polystyrene or polypropylene. 21 Direct ink writing of PANI and DBSA 123 or dinonylnaphthalene sulfonic acid, polystyrene and fused silica 124 has been demonstrated, in the latter case resulting in printed filaments with a storage modulus of about 0.2 GPa at room temperature. PANI and DBSA can also be wet-spun into fibers with a diameter below 5 μm that feature an E = 30 GPa and σ break = 1080 MPa but ε break of only 4%.…”
Section: Impact Of Chemical Doping On the Mechanical Propertiesmentioning
confidence: 99%
“…For example, PANI can be co-dissolved with camphor or aryl sulfonic acids as well as, optionally, insulating polymers such as poly(methyl methacrylate) (PMMA), polystyrene or polypropylene. 21 Direct ink writing of PANI and DBSA 123 or dinonylnaphthalene sulfonic acid, polystyrene and fused silica 124 has been demonstrated, in the latter case resulting in printed filaments with a storage modulus of about 0.2 GPa at room temperature. PANI and DBSA can also be wet-spun into fibers with a diameter below 5 μm that feature an E = 30 GPa and σ break = 1080 MPa but ε break of only 4%.…”
Section: Impact Of Chemical Doping On the Mechanical Propertiesmentioning
confidence: 99%
“…In direct ink writing (DIW), the 3D printing process is similar to the previously discussed FDM, but instead of melting and extruding thermoplastic filaments, DIW uses a nozzle to deposit a stream of ink or paste, composed of a polymer (ABS, PLA or PCL [36] PVA [37], PEDOT:PSS [38], PANI [39] or lignin [40]) suspended or solubilized in a solvent, onto a substrate. After ink deposition, solidification occurs either naturally or is assisted by an external process such as solvent evaporation, gelation, solvent-driven reactions, heat treatment, or photocuring [28].…”
Section: Direct Ink Writing (Diw)mentioning
confidence: 99%