ICMTS 2000. Proceedings of the 2000 International Conference on Microelectronic Test Structures (Cat. No.00CH37095)
DOI: 10.1109/icmts.2000.844404
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Addressable failure site test structures (AFS-TS) for process development and optimization

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Cited by 4 publications
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“…individually connected to probe pads. The use of multiplexed technology characterization circuits has been reported in this conference as early as 1986 [1] and regularly since [2][3][4][5][6][7]. The main advantage of addressable arrays is that they are not probe-pad intensive, unlike passive test chips.…”
Section: Introductionmentioning
confidence: 99%
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“…individually connected to probe pads. The use of multiplexed technology characterization circuits has been reported in this conference as early as 1986 [1] and regularly since [2][3][4][5][6][7]. The main advantage of addressable arrays is that they are not probe-pad intensive, unlike passive test chips.…”
Section: Introductionmentioning
confidence: 99%
“…The Shorts and Opens Monitor (SOM) is a read-only addressable defect array that has been extensively used at IBM for general yield learning since the 90nm technology node. While the multiplexed test structures described in [1][2][3][4][5][6][7] feature only one or two aspects listed below, the SOM simultaneously offers all of the following: critical-area efficient design, reference resistors for in-situ calibration, defect localization, soft fail detection capability, and relatively short test time.…”
Section: Introductionmentioning
confidence: 99%