2011
DOI: 10.4028/www.scientific.net/amr.197-198.344
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Adhesion and Electrical Properties of Copper Nitride Films

Abstract: Copper nitride films were prepared by reactive magnetron sputtering on glass sheets at different deposition conditions. The surface morphology of the films was evaluated by a scanning electron microscope (SEM). The SEM images demonstrate that the films have a compact structure. The structure of the films was characterized by X-ray diffraction (XRD). We focused on the influence of preparation parameters on the adhesion and electrical properties of the films. The metallurgical microscope results indicate that th… Show more

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