1996
DOI: 10.1016/0925-9635(95)00506-4
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Adhesion and structural changes of multi-layered and multi-doped a-C:H films during annealing

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Cited by 30 publications
(5 citation statements)
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“…The thermal residual stress in the DLC film that was caused by the differences in thermal expansion coefficients between the S-phase and DLC film was approximately −0.6 GPa for both the DCPN and ASPN methods under the condition for the Young's modulus that is shown in Table 5. The thermal expansion coefficient is 2.0 × 10 −6 /K 24) and Poisson's ratio is 0.2 24) . This compressive thermal residual stress in the DLC film on the S-phase was 19% of the residual stress of the DLC.…”
Section: Residual Stress On the S-phases In The Dlc Filmsmentioning
confidence: 99%
“…The thermal residual stress in the DLC film that was caused by the differences in thermal expansion coefficients between the S-phase and DLC film was approximately −0.6 GPa for both the DCPN and ASPN methods under the condition for the Young's modulus that is shown in Table 5. The thermal expansion coefficient is 2.0 × 10 −6 /K 24) and Poisson's ratio is 0.2 24) . This compressive thermal residual stress in the DLC film on the S-phase was 19% of the residual stress of the DLC.…”
Section: Residual Stress On the S-phases In The Dlc Filmsmentioning
confidence: 99%
“…The interface played an important role for high adhesion films deposition. 22 Therefore, the effect of interlayer and formation mechanism of DLC/substrate interface is important to improve the adhesion, it worth to be studied in details.…”
Section: Introductionmentioning
confidence: 99%
“…The multi-elements doped a-C:H films with multi-layered buffer structures have been studied by Oral et al . 22 It is discovered that the (Si:Ti)C/TiC interface is the weakest interface for adhesion. The interface played an important role for high adhesion films deposition.…”
Section: Introductionmentioning
confidence: 99%
“…20 Ong et al 21 found that DLC films deposited by pulsed-laser ablation showed a transition from the diamond-like to graphite at a temperature as low as 100°C. It was reported by many authors that composite DLC coatings, 22,23 i.e., incorporating other elements such as nitrogen, boron, silicon, oxygen, fluorine, or some metals, have been shown to overcome some intrinsic application difficulties of DLC, such as reducing internal stresses, enhancing adhesion and mechanical properties, modifying surface energy, and improving thermal stability. One particular class of modified DLC coatings are diamond-like nanocomposite ͑DLN͒ films.…”
Section: Introductionmentioning
confidence: 99%