Adhesion and XPS studies on a fluoropolymer-metal interface

Park, J.M.; Matienzo, Luis J.; Spencer, D.F.

doi:10.1163/156856191x00107

Cited by 41 publications

(16 citation statements)

References 3 publications

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“…(5) high-temperature lamination with chromium-coated copper foil at 380 • C [12]; and (6) treatment in gaseous MW plasma mixtures that incorporate oxygen and result in Cu O bonds at the interface to enhance adhesion [6,7].…”

Section: Introductionmentioning

confidence: 99%

Surface modification of Teflon® PFA with vacuum UV photo-oxidation

Dasilva¹,

Entenberg²,

Kahn³

et al. 2006

Journal of Adhesion Science and Technology

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Surface modification of poly(tetrafluoroethylene-co-perfluoropropyl vinyl ether) (PFA) with vacuum UV (VUV) photo-oxidation using radiation from excited Ar atoms downstream from an Ar microwave (MW) plasma shows: (1) an improvement in wettability as observed by water contactangle measurements; (2) surface roughening; (3) incorporation of oxygen as C O, CF O CF 2 and CF 2 O CF 2 moieties and (4) enhancement of the CF O C n F 2n+1 concentration. Adhesion measurements of Cu sputter coated onto the photo-oxidized PFA surface results in failure within the PFA (cohesive failure) and not at the Cu-PFA interface.

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Section: Introductionmentioning

confidence: 99%

Surface modification of Teflon® PFA with vacuum UV photo-oxidation

Dasilva¹,

Entenberg²,

Kahn³

et al. 2006

Journal of Adhesion Science and Technology

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“…Such techniques give rise to new properties either by grafting new chemical moieties or plasma deposition of polymeric films [1][2][3][4][5].…”

Section: Introductionmentioning

confidence: 99%

Surface modification of polyethylene powder by nitrogen and ammonia low pressure plasma in a fluidized bed reactor

Bretagnol

Tatoulian

Arefi‐Khonsari

et al. 2004

Reactive and Functional Polymers

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“…Indeed, in the case of the adhesion improvement of copper on fluoropolymers, polytetrafluoroethylene (PTFE) and PVDF, for microelectronics and optical applications [11], the efficiency of N 2 /H 2 plasmas was proved compared to that of NH 3 . However, in the case of pure hydrogen, the adhesion of copper to hydrogenplasma-treated fluoropolymers was very poor, indicating the important role of NH x radicals [12].…”

mentioning

confidence: 99%

Surface Modification of PVDF by Microwave Plasma Treatment for Electroless Metallization

Pascu

Debarnot

Durand

et al. 2005

Plasma Processes and Polymers

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Piezoelectric and nonpiezoelectric films of polyvinylidene fluoride (PVDF) have been treated in a microwave nitrogen and hydrogen plasma. Plasma parameters, e.g. ratio between N 2 and H 2 , plasma power, gas flow rate, and the distance between the sample and the plasma have been varied in order to establish the treatment parameters that constitute a good compromise between an optimum functionalization and a minimum degradation. Under this treatment, the surface properties of PVDF have been modified in a controlled manner, allowing its metallization, necessary in a wide range of applications, without significantly changing its bulk properties. IntroductionSurface modification, especially metallization, of fluoropolymers is of a particular interest, as these polymeric substrates are one of the most important families of engineering polymers, well known for their physical and chemical inertness [1]. Fluoropolymers are characterized by a small surface energy, which does not allow an adequate adhesion with a metal layer. This is why activation of polymer surfaces prior to metallization is absolutely necessary [2]. This activation process allows the polymer surface to become hydrophilic, in order to be well wet by an electrolessplating solution [3,4]. Gas-plasma treatment under various glow-discharge conditions was extensively used for this type of surface modification of fluoropolymers [5]. To deposit copper, it was proved that the treatment by N 2 , NH 3 or O 2 plasmas increased the reactivity of polymers [6][7][8]. Polar groups introduced by plasma treatment on the film surface favor the reaction of copper to form a copper-nitrogen-carbon complex in the interface region [9]. Different mixtures of N 2 and H 2 , which are more environmentally friendly and easier to handle in industry than ammonia, were studied in order to improve the adhesion of copper onto fluoropolymers. Low-temperature plasmas of nitrogen/hydrogen mixtures contain NH x gaseous precursors that can induce the formation of amino groups at the surface. For example, using a N 2 /H 2 plasma for treating polypropylene (PP) surface, a signifi-

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Adhesion and XPS studies on a fluoropolymer-metal interface

Cited by 41 publications

References 3 publications

Surface modification of Teflon® PFA with vacuum UV photo-oxidation

Surface modification of Teflon® PFA with vacuum UV photo-oxidation

Surface modification of polyethylene powder by nitrogen and ammonia low pressure plasma in a fluidized bed reactor

Surface Modification of PVDF by Microwave Plasma Treatment for Electroless Metallization

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