Insufficient interfacial adhesion is a widespread problem
across
multilayered devices that undermines their reliability. In flexible
organic photovoltaics (OPVs), poor interfacial adhesion can accelerate
degradation and failure under mechanical deformations due to the intrinsic
brittleness and mismatching mechanical properties between functional
layers. We introduce an argon plasma treatment for OPV devices, which
yields 58% strengthening in interfacial adhesion between an active
layer and a MoO
X
hole transport layer,
thus contributing to mechanical reliability. The improved adhesion
is attributed to the increased surface energy of the active layer
that occurred after the mild argon plasma treatment. The mechanically
stabilized interface retards the flexible device degradation induced
by mechanical stress and maintains a power conversion efficiency of
94.8% after 10,000 cycles of bending with a radius of 2.5 mm. In addition,
a fabricated 3 μm thick ultraflexible OPV device shows excellent
mechanical robustness, retaining 91.0% of the initial efficiency after
1000 compressing–stretching cycles with a 40% compression ratio.
The developed ultraflexible OPV devices can operate stably at the
maximum power point under continuous 1 sun illumination for 500 min
with an 89.3% efficiency retention. Overall, we validate a simple
interfacial linking strategy for efficient and mechanically robust
flexible and ultraflexible OPVs.