Adhesion of reactive silver inks on indium tin oxide

Mamidanna, Avinash; Jeffries, April; Bertoni, Mariana I.; Hildreth, Owen

doi:10.1007/s10853-018-3017-6

Cited by 8 publications

(14 citation statements)

References 12 publications

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“…Most researchers print the RSI at room temperature, where ligand evaporation is the sole reduction mechanism, then employ a post-processing step to thermally decompose residual silver complexes, and densify the film. − Post-processing is time-consuming, especially for reactive inks that often require printing multiple layers . Printing on heated substrates can eliminate the need for post-processing, and the resulting simultaneous reduction mechanisms afford greater control over film morphology since each mechanism leads to different morphologies. , …”

Section: Resultsmentioning

confidence: 99%

“… The complexing agent’s vapor pressure impacts its evaporation rate, which can affect the relative amounts of thermal and evaporation-driven silver reduction. Mamidanna et al studied this by measuring the reaction kinetics of ammonia and ethylamine-based RSI systems . They used the reaction kinetics in a multiphysics model of silver formation rates across a droplet of RSI at temperatures between 40 and 80 °C.…”

Section: Resultsmentioning

confidence: 99%

“…Substrates were prepared using the same procedure as the top-down and cross-sectional samples to mimic the surface of SHJ cells. The peel experiments followed the procedure by Mamidanna et al 19 Polyimide tape (CS Hyde 8-1S-1-36, 2.54 cm width, silicone adhesive) was applied perpendicularly to printed lines using a 150 g metal roller. The far end of the tape was attached to a low-profile load cell (5 N Instron 2530) for 180°peel tests.…”

Section: Cross-sectional Morphology and Total Resistivitymentioning

confidence: 99%

“…However, the paper did not note the silver consumption of the two cells and mentioned that optimizing ink formula could improve cell efficiency. Mamidanna et al investigated RSI metallization reliability by studying RSI adhesion on indium tin oxide (ITO), the top layer material in SHJ cells . Their work showed how a puckering phenomenon could result in poor adhesion and how adjusting processing parameters like ink dilution, droplet diameter, and the number of passes could result in excellent adhesion.…”

Section: Introductionmentioning

confidence: 99%

“…Mamidanna et al investigated RSI metallization reliability by studying RSI adhesion on indium tin oxide (ITO), the top layer material in SHJ cells. 19 Their work showed how a puckering phenomenon could result in poor adhesion and how adjusting processing parameters like ink dilution, droplet diameter, and the number of passes could result in excellent adhesion. Jeffries et al studied the corrosion mechanisms of RSI metallization in encapsulated modules using damp-heat testing.…”

Section: Introductionmentioning

confidence: 99%

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Investigation of Reactive Silver Ink Formula for Reduced Silver Consumption in Silicon Heterojunction Metallization

DiGregorio

Martinez-Szewczyk

Raikar

et al. 2023

ACS Appl. Energy Mater.

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Silver is the most expensive non-silicon component in photovoltaic cells. This is particularly salient for silicon heterojunction (SHJ) cells, which rely on large quantities of low-temperature silver pastes (LT-SP). SHJ cells would benefit greatly from an industrially scalable metallization process that simultaneously offers low silver consumption, low finger resistivities (<20 μΩ·cm), and low processing temperatures. Printed reactive silver inks (RSI) are an innovative candidate to this end. This work furthers the research on RSI metallization by investigating the impact of ink formula on properties pertinent to SHJ cells, including electrical properties, line width, ink splatter, silver consumption, cell performance, and adhesion. We introduce a scalable, high-throughput flexible needle contact printing approach for metallization that solves many of the issues associated with drop-on-demand printing. The printed silver fingers are characterized using electrical measurements and top-down and cross-sectional microscopy. The best performing ink, consisting of silver acetate, ethylamine, and formic acid, achieved silver fingers with total resistivities of 3.1 μΩ·cm and contact resistivities of 3.2 mΩ·cm2 when printed at 61 °C. This ink metallized a full-sized 156 mm × 156 mm SHJ cell. This is the first reported data for RSI metallization of a full-sized SHJ cell and shows how an optimized RSI can achieve similar performances to LT-SP while consuming 80–90% less silver.

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