Adhesive characteristics of epoxy glue in relation to the microgeometry of the substrate surface

Smirnova, E. O.; Veretennikova, I. А.; Смирнов, С. В.; Пестов, А. В.; Коновалов, Д. А.

doi:10.1063/1.5084427

Cited by 3 publications

(2 citation statements)

References 5 publications

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“…В качестве подложки использовали пластины толщиной 3 мм, диной 85 мм и шириной 30 мм, изготовленные из алюминий-магниевого сплава АМг6, с величиной шероховатости Ra=0,35 мкм, обеспечивающей максимальную адгезионную прочность покрытия [25]. Удаление оксидной пленки и достижение требуемой шероховатости достигалось путем фрезерования поверхности подложки.…”

Section: материалы и оборудованиеunclassified

Effect of hardeners on the mechanical properties of epoxy coatings based on ED-20 resin

Смирнов¹,

Veretennikova²,

Коновалов³

et al. 2023

DREAM

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The aim of this study is to investigate the mechanical properties of coatings based on ED-20 epoxy resin, manufactured with polyethylenepolyamine or polyamidepolyamine used as hardeners. Instrumented indentation with a Berkovich triangular pyramid is used to determine the mechanical properties. Indentation hardness, reduced elastic modulus, and creep at a given holding time are used as the characteristic parameters. The results testify that the mechanical properties of the epoxy coatings made with different hardeners differ significantly from each other and demonstrate different behaviors.

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Section: материалы и оборудованиеunclassified

Effect of hardeners on the mechanical properties of epoxy coatings based on ED-20 resin

Смирнов¹,

Veretennikova²,

Коновалов³

et al. 2023

DREAM

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“…[ 3‐8 ] The fillers are used to obtain the desired viscosity, reduce shrinkage, and reduce the temperature coefficient of expansion, to reduce the cost of the product and its coloring. [ 9‐15 ]…”

Section: Introductionmentioning

confidence: 99%

Kinetic features of polymerization of epoxy resin modified by silicon‐containing additives and mineral fillers

Kovaleva

Савотченко

2021

Polymer Engineering & Sci

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In this article, we study the process of polymerization of a modified ED-20 epoxy binder under conditions of highly filled systems. It is found that modifying additives affect the process of polymerization of the binder, increasing the degree of conversion of epoxy groups of ED-20 resin, speeding up the process of polymerization, and increasing the exothermic effect of the reaction. Curing in the presence of a modifying silicon-containing additive takes place in a mode that promotes the formation of a more ordered structure, creating opportunities for relaxation of internal stresses and favorable conditions for the formation of an ordered microstructure. The equations sufficiently fitting the measured points of the concentration of epoxy groups are calculated. We obtain the kinetic curves of curing, which illustrate the process of heat release of the ED-20 binder and the same system modified with mineral fillers. It is found that the heat release occurs more intensively when modifiers are introduced into the epoxy binder. It is derived that the experimental data of kinetics of heat release at considered time range can be sufficiently described by a parabolic equation.

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Estimating the repeatability of experimental data obtained in scratch testing of a polymer epoxy coating

Коновалов

Veretennikova

Smirnova

2020

MECHANICS, RESOURCE AND DIAGNOSTICS OF MATERIALS AND STRUCTURES (MRDMS-2020): Proceeding of the 14th International Conference O

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Adhesive characteristics of epoxy glue in relation to the microgeometry of the substrate surface

Cited by 3 publications

References 5 publications

Effect of hardeners on the mechanical properties of epoxy coatings based on ED-20 resin

Effect of hardeners on the mechanical properties of epoxy coatings based on ED-20 resin

Kinetic features of polymerization of epoxy resin modified by silicon‐containing additives and mineral fillers

Estimating the repeatability of experimental data obtained in scratch testing of a polymer epoxy coating

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