Kinetic features of polymerization of epoxy resin modified by silicon‐containing additives and mineral fillers

Abstract

In this article, we study the process of polymerization of a modified ED-20 epoxy binder under conditions of highly filled systems. It is found that modifying additives affect the process of polymerization of the binder, increasing the degree of conversion of epoxy groups of ED-20 resin, speeding up the process of polymerization, and increasing the exothermic effect of the reaction. Curing in the presence of a modifying silicon-containing additive takes place in a mode that promotes the formation of a more ordered structure, creating opportunities for relaxation of internal stresses and favorable conditions for the formation of an ordered microstructure. The equations sufficiently fitting the measured points of the concentration of epoxy groups are calculated. We obtain the kinetic curves of curing, which illustrate the process of heat release of the ED-20 binder and the same system modified with mineral fillers. It is found that the heat release occurs more intensively when modifiers are introduced into the epoxy binder. It is derived that the experimental data of kinetics of heat release at considered time range can be sufficiently described by a parabolic equation.

The multifaceted role of water as an accelerator of the crosslinking reaction of isocyanate-free polyurethane networks

“…Nevertheless, small additions of unreactive molecules, sometimes called plasticizers, are classically incorporated in thermosetting formulations to impart molecular mobility and to improve the diffusion of the monomers, especially when approaching the vitrification of the polymeric network. 12,16,17 In that case, an imperative prerequisite is to use innocuous compounds as they might leak out of the network and contribute to the emission of undesirable volatile organic compounds.…”

Epoxy resin matrix integrating epoxy‐polydimethylsiloxane based self‐healing microcapsules: Healing efficiency, mechanical and thermal stability

“…[16][17][18] However, numerous investigations point out some dissimilarities among the healing of base physical performance and emphasized subjects related to their application. [16,17,[19][20][21][22][23] Epoxy resins as polymeric thermosets are generally used in manufacturing applications owing to their outstanding mechanical, physical, and chemical properties. Epoxy resin can be the extra beneficial ingredients as a matrix over another available matrix composite in detail of price and healing effectiveness for self-healing systems.…”

Research on structure and properties of MWCNT@PDA/polymer matrix composite films with enhanced energy storage performance

“…Electric energy storage equipment has a high‐power density due to its ultra‐fast charge and discharge capabilities, which can meet the specific needs of various fields, such as artificial muscles, capacitors, and smart skins. [ 1–7 ] As the important part of capacitors, materials with high dielectric constant and its energy storage performance determines the performance of capacitors. A single dielectric material has been difficult to meet the needs of industrialization.…”