Adhesives Technology Handbook

Landrock, Arthur H.; Bell, James P.

doi:10.1115/1.3225943

Cited by 36 publications

(16 citation statements)

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“…Chemical composition of hide glue is a protein derived from the simple hydrolysis of collagen which is a principal protein constituent of animal hides. Collagen, hide glue and gelatin are very closely related as to protein and chemical composition [25][26][27]. Through the infusion of the risen inside the Lumina, the inner wall of the straw will absorb the glue which is water soluble and penetrating in the open areas in the stem cross section.…”

Section: Composites Preparationmentioning

confidence: 99%

Analysis of the Wheat Straw/Flax Fiber Reinforced Polymer Hybrid Composites

Messiry¹,

R²

2016

J Appl Mech Eng

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In the last decades, the agro wastes in manufacturing different types of composites found the increasing utilization. The world statistics of the Wheat and rice straw indicates that about 710 million metric tons of Wheat straw and 670 million tons of rice straw are produced each year as the agricultural waste, beside the other cereal and forest waste. Therefore, it causes a huge environmental impact and this problem is growing each year. The production of plastic composites from agro waste materials is receiving the substantial consideration currently. In this work, we suggest to use the Wheat straw in its whole shape instead of shredded one for forming the green composite. The hybrid composite was formed of Wheat straw, flax fiber, and jute fabric. This study targets at the mechanical properties of Wheat straw. The results indicate the possibility of manufacturing of the thin plates and shafts from such hybrid combinations after the increasing the crushing force of Wheat straw.

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Section: Composites Preparationmentioning

confidence: 99%

Analysis of the Wheat Straw/Flax Fiber Reinforced Polymer Hybrid Composites

Messiry¹,

R²

2016

J Appl Mech Eng

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“…The principal advantages of adhesive bonding are minimal alteration of the chemical composition and microstructure of the adherends, suitability to joining dissimilar materials, ability to produce large loadbearing areas, tendency to distribute loading, and capability for sealing, insulating, damping, and resisting fatigue [14]. The greatest shortcoming of adhesive bonding is susceptibility to degradation by a number of environmental factors, including extremes of temperature, extremes of moisture, and attack by solvents, ultraviolet radiation, fungus and vermin.…”

Section: Adhesive Bondingmentioning

confidence: 99%

Joining Composite Materials and Structures: Some Thought-Provoking Possibilities

Messler

2004

Journal of Thermoplastic Composite Materials

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Custom-engineered functionally-specific properties leading to greatly enhanced design versatility have drawn designers to composites, but will make these materials-of-preference only if better ways can be found for producing better joints. The very micro-and macrostructure that gives rise to the unparalleled properties possible with composites exacerbates the inherent weaknesses virtually always associated with joints. Prevailing methods of mechanical fastening and adhesive or thermal bonding (welding) are nonoptimal, if not inappropriate, extensions of methods used for joining conventional metallic or polymeric structures with little real change in over two millennia. This paper challenges the old paradigm of joining being a pragmatic process performed as a last step in manufacture and proposes that it must increasingly become an enabling technology that is integrated with material and structure synthesis. Four new ways to think about joining composites are proposed, and a possibility for each approach is presented to provoke thinking among design and process engineers.

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“…25 Cohesive failure is the desirable mode of failure because it indicates that the adhesive bond was strong enough to prevent failure at the interface.…”

Section: Mechanism Of Bond Failure Between Ple and Surfaces Treated Wmentioning

confidence: 99%

Photopolymerizable liquid encapsulants for microelectronic devices: Thermal and mechanical properties of systems with reduced in‐mold cure times

Baikerikar¹,

Scranton²

2001

J of Applied Polymer Sci

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Photopolymerizable liquid encapsulants (PLEs) for microelectronic devices may offer important advantages over traditional transfer molding compounds, including reduced in-mold cure times, lower thermal stresses, and reduced wire sweep. In this contribution, we discuss an encapsulation process based upon a low viscosity resin that cures rapidly upon exposure to UV light. These highly filled PLEs are comprised of an epoxy novolac-based vinyl ester resin (ϳ25 wt %), fused silica filler (70 -74 wt %), photoinitiator, silane coupling agent, and, in some cases, a thermal initiator. We have characterized the material properties (flexural strength and modulus, coefficient of thermal expansion, glass transition temperature, and thermal stress parameter) of PLEs cured with UV illumination times of 60, 90, and 120 s, as well as, the thermal conductivity and adhesive peel strength of PLEs photocured for 90 s. In addition, we investigated the effect of the fused silica loading and the initiation scheme on these properties. The results indicate that the PLEs are very promising for microelectronic encapsulation. These liquid encapsulants cure (to an ejectable hardness) in 1 min for an initiating light intensity of 200 mW/cm 2 , and exhibit appropriate values for the thermal and mechanical properties listed above.

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Adhesives Technology Handbook

Cited by 36 publications

References 0 publications

Analysis of the Wheat Straw/Flax Fiber Reinforced Polymer Hybrid Composites

Analysis of the Wheat Straw/Flax Fiber Reinforced Polymer Hybrid Composites

Joining Composite Materials and Structures: Some Thought-Provoking Possibilities

Photopolymerizable liquid encapsulants for microelectronic devices: Thermal and mechanical properties of systems with reduced in‐mold cure times

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