Adsorption and thermal chemistry of 1,1,1,5,5,5,-hexafluoro-2,4-pentanedione (hfacH) and (hexafluoroacetylacetonate)Cu(vinyltrimethylsilane) ((hfac)Cu(VTMS)) on TiCN-covered Si(100) surface

Pirolli, Laurent; Teplyakov, Andrew V.

doi:10.1016/j.susc.2006.09.018

Cited by 19 publications

(31 citation statements)

References 29 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Once the reactions of organometallic compounds are understood on an ordered substrate, the insight obtained for this reaction can be applied to more complex surfaces, as demonstrated in our study of [Cu(hfac)(vtms)] on TiCN films 6. 43, 44 Having entered the nanoscale age for film deposition and with molecular electronics emerging as a promising field to continue the improvement of electronic devices, chemistry is called upon to be the center of attention for its capacity to understand, design, and control the reactions involved in the formation of electronic devices at the atomic scale.…”

Section: Final Remarksmentioning

confidence: 97%

Chemistry of Organometallic Compounds on Silicon: The First Step in Film Growth

Rodríguez‐Reyes

Teplyakov

2007

Chem. Eur. J.

View full text Add to dashboard Cite

The continuous decrease in size of electronic devices has reached a critical point at which the molecular-level understanding of chemical processes is imperative. Metal-containing films, an important part of every circuit, are currently deposited from a myriad of organometallic compounds, in order to control the first stages of film growth and ultimately produce an atomically defined interface. This article outlines recent molecular-level investigations on reactions of organometallic compounds with silicon surfaces. The role of surface structure and chemical state is placed in a framework of future challenges and opportunities for applications in electronics.

show abstract

Section: Final Remarksmentioning

confidence: 97%

Chemistry of Organometallic Compounds on Silicon: The First Step in Film Growth

Rodríguez‐Reyes

Teplyakov

2007

Chem. Eur. J.

View full text Add to dashboard Cite

show abstract

“…The synthesis of Cu(I) and Ag(I) metal organic complexes is commonly achieved by reacting a transition metal salt with the desired oxidation state with a combination of an anionic ligand and a -donor ligand in a one-pot reaction followed by purification [163][164][165][166][167][168][169][170][171][172][173][174][175][176][177][178]. Similarly, Cu(II) MC precursors are obtained in an analogous manner from Cu(II) salts [179][180][181][182].…”

Section: Metal Complexes Applicable To Inkjet Ink Formulationsmentioning

confidence: 99%

Metal-based Inkjet Inks for Printed Electronics

Kamyshny¹,

Steinke²,

Magdassi

2011

TOAPJ

370

242

View full text Add to dashboard Cite

Abstract:A review on applications of metal-based inkjet inks for printed electronics with a particular focus on inks containing metal nanoparticles, complexes and metallo-organic compounds. The review describes the preparation of such inks and obtaining conductive patterns by using various sintering methods: thermal, photonic, microwave, plasma, electrical, and chemically triggered. Various applications of metal-based inkjet inks (metallization of solar cell, RFID antennas, OLEDs, thin film transistors, electroluminescence devices) are reviewed.

show abstract

“…3.40, it was concluded that the remaining species is the hfac ligand bonded to a copper atom, which is in turn bound to silicon surface, structure A [356]. These findings were later expanded to explain the structural characteristics of thin diffusion barrier film, TiCN [360][361][362], and to understand the chemical reactivity of its surface [363,364] with respect to the copper deposition process. Most of the other investigations of the effects of a metal presence on the chemistry of organometallic molecules are related to the chemistry of deposition of metals and metal compounds onto silicon.…”

Section: Effect Of Metal Atoms On the Pathways Of Chemical Reactions mentioning

confidence: 99%