Advanced 3D Technologies and Architectures for 3D Smart Image Sensors

Vivet, Pascal; Sicard, Gilles; Millet, Laurent; Chevobbe, Stéphane; Chehida, Karim Ben; Cubero, Luis; Alegre, Monte; Bouvier, Maxence; Valentian, Alexandre; Lepecq, Maria; Thomas, Dombek; Bichler, Olivier; Thuries, Sébastien; Lattard, Didier; Chéramy, S.; Batude, P.; Clermidy, Fabien

doi:10.23919/date.2019.8714886

Cited by 12 publications

(6 citation statements)

References 25 publications

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“…Image sensors largely benefit from 3D IC technologies, with for example Cu-Cu bonding, for numerous reasons [4], [5]. It provides more space for maximizing the pixel fill factor and allows heterogeneous integration, i.e.…”

Section: B 3d Integrated Circuit Technologymentioning

confidence: 99%

“…As a solution, this work presents a neural processing unit evaluating a Convolutional Spiking Neural Network (CSNN) conceived to be easily distributed behind an EB pixel grid by employing 3D IC technologies [4], [5]. Analogously to biological neurons of the striate cortex [6], the CSNN evaluated by the neuromorphic core detects oriented edges in the raw input EB data stream.…”

Section: Introductionmentioning

confidence: 99%

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Scalable Pitch-Constrained Neural Processing Unit for 3D Integration with Event-Based Imagers

Bouvier

Valentian

Sicard

2021

2021 58th ACM/IEEE Design Automation Conference (DAC)

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Event-based imagers are bio-inspired sensors presenting intrinsic High Dynamic Range and High Acquisition Speed properties. However, noisy pixels and asynchronous readout result in poor energyefficiency and excessively large output data rates.In this work, we use Convolutional Spiking Neural Network filters to compensate these drawbacks and reduce output bandwidth by 10x.We designed a neuromorphic core as a distributable block that benefits from 3D integration technology with direct and parallel access to 32x32 pixels, enabling reduced frequency operation. Post-layout simulations depict a peak energy efficiency with 2.83pJ per Synaptic Operation (equivalent to 0.093fJ/event/pix) at the nominal literature input event rate.

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Section: B 3d Integrated Circuit Technologymentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Scalable Pitch-Constrained Neural Processing Unit for 3D Integration with Event-Based Imagers

Bouvier

Valentian

Sicard

2021

2021 58th ACM/IEEE Design Automation Conference (DAC)

Self Cite

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“…Indeed, one of the most promising integration for the newest CMOS Imager Sensor (CIS) is a 3D or 3D-sequential integration (Fig. 1, [14]).…”

Section: Introductionmentioning

confidence: 99%

On the influence of Ni(Pt)Si thin film formation on agglomeration threshold temperature and its impact on 3D imaging technology integration

Gregoire

Anak

Verdier

et al. 2023

Microelectronic Engineering

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“…In addition, 3DSI offers 3D contacts of outstanding high-density between tiers (up to 10 8 3D via/mm 2 ), enabling partitioning with high connectivity and low latency. Therefore 3DSI allows the co-integration of dense logic and memory layers but also heterogeneous components such as MEMS/NEMS for the compact coexistence of sensing and computing [7].…”

Section: Introductionmentioning

confidence: 99%

Parasitic Coupling in 3D Sequential Integration: The Example of a Two-Layer 3D Pixel

et al. 2022

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In this paper, we present a thorough analysis of parasitic coupling effects between different electrodes for a 3D Sequential Integration circuit example comprising stacked devices. More specifically, this study is performed for a Back-Side Illuminated, 4T–APS, 3D Sequential Integration pixel with both its photodiode and Transfer Gate at the bottom tier and the other parts of the circuit on the top tier. The effects of voltage bias and 3D inter-tier contacts are studied by using TCAD simulations. Coupling-induced electrical parameter variations are compared against variations due to temperature change, revealing that these two effects can cause similar levels of readout error for the top-tier readout circuit. On the bright side, we also demonstrate that in the case of a rolling shutter pixel readout, the coupling effect becomes nearly negligible. Therefore, we estimate that the presence of an inter-tier ground plane, normally used for electrical isolation, is not strictly mandatory for Monolithic 3D pixels.

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Advanced 3D Technologies and Architectures for 3D Smart Image Sensors

Cited by 12 publications

References 25 publications

Scalable Pitch-Constrained Neural Processing Unit for 3D Integration with Event-Based Imagers

Scalable Pitch-Constrained Neural Processing Unit for 3D Integration with Event-Based Imagers

On the influence of Ni(Pt)Si thin film formation on agglomeration threshold temperature and its impact on 3D imaging technology integration

Parasitic Coupling in 3D Sequential Integration: The Example of a Two-Layer 3D Pixel

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