2005
DOI: 10.1016/j.mejo.2005.04.039
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Advanced etching of silicon based on deep reactive ion etching for silicon high aspect ratio microstructures and three-dimensional micro- and nanostructures

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Cited by 272 publications
(150 citation statements)
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“…Current methods used to produce X-ray diffractive optics include top-down methods involving patterning of a thick resist mould 6,7 , pattern transfer into a substrate using deep reactive ion etching [8][9][10] , anisotropic Si wet etch 11,12 , multiple patterning techniques 13 , multilayer Laue lens, various multilayer-sliced zone plate techniques 14 , lithographic stacking 15 and mechanical stacking 16 . Advantages and tradeoffs exist with each method.…”
mentioning
confidence: 99%
“…Current methods used to produce X-ray diffractive optics include top-down methods involving patterning of a thick resist mould 6,7 , pattern transfer into a substrate using deep reactive ion etching [8][9][10] , anisotropic Si wet etch 11,12 , multiple patterning techniques 13 , multilayer Laue lens, various multilayer-sliced zone plate techniques 14 , lithographic stacking 15 and mechanical stacking 16 . Advantages and tradeoffs exist with each method.…”
mentioning
confidence: 99%
“…An additional advantage of AMCPs is that channel micromachining is performed using deep reactive ion etching (DRIE), which allows the channel geometry to be fully customized and adapted to the readout electronics. The combination of photolithography and DRIE can provide aspect ratios comparable to lead-glass MCPs [100].…”
Section: Amcp Conceptmentioning
confidence: 99%
“…In the next step, metal is deposited on the backside of the wafer where it is patterned by the backside layout mask and then etched. We turn again to the front side to make Deep Reactive Ion etching (DRIE) for the silicon structure layer [Marty et al 2005]. At that level, both the oxide and the aluminum serve as mask materials for silicon etching by DRIE.…”
Section: Q = 662mentioning
confidence: 99%