2017
DOI: 10.1117/12.2260001
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Advanced lithographic filtration and contamination control for 14nm node and beyond semiconductor processes

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Cited by 4 publications
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“…Among the metal ions studied, ions such as Na, K, Fe, and Ni are mostly encountered in the solvents used in the microelectronics industry and their removal is challenging. 6 As shown in Figure 2A, the metal ions such as Fe and Ni ions were removed more efficiently compared with monovalent ions such as K and Na ions. The higher removal efficiency of Fe and Ni ions can be attributed to the higher electrostatic attraction between MXene and divalent/multivalent ions compared to monovalent ions.…”
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confidence: 91%
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“…Among the metal ions studied, ions such as Na, K, Fe, and Ni are mostly encountered in the solvents used in the microelectronics industry and their removal is challenging. 6 As shown in Figure 2A, the metal ions such as Fe and Ni ions were removed more efficiently compared with monovalent ions such as K and Na ions. The higher removal efficiency of Fe and Ni ions can be attributed to the higher electrostatic attraction between MXene and divalent/multivalent ions compared to monovalent ions.…”
mentioning
confidence: 91%
“…4,5 Although most particles can be removed by a sieving mechanism using nanofiltration membranes, the removal of trace amounts of metal ions is challenging. 6 For instance, metal ions such as Fe, Cu, Ni, Cr, Co, Pt, and Ir dissolve in the Si matrix and/or form silicide, causing p−n junction leakage. 7 Additionally, Cr contamination results in reliability degradation of the gate dielectric.…”
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confidence: 99%
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