Advanced Low Loss Dielectric Material Reliability and Filter Characteristics at High Frequency for mmWave Applications

Kakutani, Takenori; Okamoto, Daichi; Guan, Zhong; Suzuki, Yuya; Ali, Muhammad; Watanabe, Atom O.; Kathaperumal, Mohanalingam; Swaminathan, Madhavan

doi:10.1109/ectc32862.2020.00108

Cited by 18 publications

(5 citation statements)

References 6 publications

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“…BF has a low CTE, low dielectric loss, low moisture absorption, high Tg, great mechanical properties, reliable insulation, and great durability, and is very suitable for constructing semiconductor packaging substrate with fine line, high pin counts and high frequency transmission [77,78]. The substrate in the Flip-Chip Ball Grid Array (FCBGA) technology is comprised of bismaleimide-triazine (BT) resin glass fibre composite as the core board and BF as double-sided build-up layers (Figure 6b) [79,80]. The BF-based substrate is covered with plated copper layer instead of laminated copper foil [81], which can reduce the overall thickness of the substrate, rationalise layout of redistribution layer, and reduce the difficulty of laser drilling [82].…”

Section: Substratesmentioning

confidence: 99%

Polymer‐based nanocomposites in semiconductor packaging

Sun

2023

IET Nanodielectrics

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Semiconductor packaging materials play a critical role in the development of semiconductor devices. They not only provide reliable protection and support, but also contribute to the electrical connection between the chip and the external circuit. Among many choices of packaging materials, polymer‐based nanocomposites have become the mainstream candidate due to their low cost, easy processability, and tunable properties. Materials with low dielectric constant and dielectric loss, high glass transition temperature, fast thermal conductivity, suitable coefficient of thermal expansion, low viscosity, and good processability are commonly required in semiconductor packaging, yet most polymers do not meet these criteria. Therefore, modulation of the polymer matrix, introduction of suitable fillers, and modification of the filler surface are often effective approaches to enhance the performance of the composites. Here, the authors first review current research progresses of polymer‐based nanocomposites for five different types of packaging applications, namely moulding compounds, thermal interface materials, underfills, die attach materials, and substrates. The authors then present prospects of developing next‐generation polymer‐based nanocomposites for advanced semiconductor packaging and propose some suggestions to solve the existing challenges.

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Section: Substratesmentioning

confidence: 99%

Polymer‐based nanocomposites in semiconductor packaging

Sun

2023

IET Nanodielectrics

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“…The rapid expansion of wireless networking, communication [1], radar, and medical systems [2], [3] necessitated the development of novel materials in radio frequency (RF) and microwave engineering. Apart from the geometry and design of devices, microwave design is heavily influenced by the dielectric characteristics of materials.…”

Section: Introductionmentioning

confidence: 99%

Design of resonator cavity for liquid material characterization

et al. 2022

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Dielectric characterization is very essential before the material can be utilized in designing microwave networks. Circular cylindrical resonators have been widely used for material characterization, but it is not a preferable design during the measurement of liquid samples as the sample placement requires repetitive process of opening and closing the lid of the cavity. This repetition procedure easily affects the accuracy of measurement and may lead to a measurement error. In this study, a rapid and less measurement procedure of liquid material characterization is proposed. The proposed rectangular resonator design is far more convenient and easier to handle as it does not require complex sample preparation. Considering electric field leakage, a hole is designed at the top of the cavity to ease the inserting process of sample. A 5-GHz prototype of a rectangular resonator is designed and fabricated to measure a liquid sample. Complex scattering parameters are measured using a vector network analyzer before the dielectric properties are estimated using an inverse technique. The dielectric properties of distilled water are measured to demonstrate the practicality of the proposed measurement technique. As a result, the measured dielectric properties of distilled water show a reasonable agreement with the values from other literature.

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“…The semiconducting materials have identified five major growth applications: (1) mobile, such as smartphones, notebooks, wearables, tablets, etc., [1][2][3][4]; (2) high-performance computing (HPC), which is able to process data and perform complex calculations at high speeds on a supercomputer [5,6]; (3) self-driving cars [7]; (4) Internet Of Things (IOT), such as smart health and smart factories; [3,8,9] and (5) instant data (for edge computing) and big data (for cloud computing) [5,6]. To meet the requirements for boosting signal transmission speed/rate and managing a huge data flood, low-loss (dissipation factor or loss tangent) and permittivity materials are highly preferred [10,11].…”

Section: Introductionmentioning

confidence: 99%

Electrical, Microstructural and Physical Characteristics of Talc-based Cordierite Ceramics

Yahya

Soltan

Mahani

et al. 2022

Silicon

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The aim of this work is to study the effect of various talc rocks for the preparation of talc-based cordierite ceramics. Raw talc and sintered cordierite-based ceramic samples (1000-1375ºC for 2 h) were characterized using XRD, XRF, TGA-DTG, laser PSDs, Archimedes method, SEM-EDAX and dielectric relaxation spectrometer (DRS). Results show that impurity oxide contents, particle size and mineralogical changes of green batches influenced the microstructure densification and crystallization of orthorhombic and hexagonal cordierite. The complex electric modulus plot shows the existence of two relaxation processes associated with the capacitive contribution grain boundaries and grain at low and high frequencies, respectively. The dielectric loss reached much lower values (0.0004–0.0007) for the ceramics composed of higher cordierite phase composition (87.00 to 92.00wt.%) that sintered at 1350 and 1375ºC. Such ceramics could be promising in electronic applications like capacitors, microwave devices and wireless communication.

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Advanced Low Loss Dielectric Material Reliability and Filter Characteristics at High Frequency for mmWave Applications

Cited by 18 publications

References 6 publications

Polymer‐based nanocomposites in semiconductor packaging

Polymer‐based nanocomposites in semiconductor packaging

Design of resonator cavity for liquid material characterization

Electrical, Microstructural and Physical Characteristics of Talc-based Cordierite Ceramics

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