Polymer‐based nanocomposites in semiconductor packaging

Abstract

Semiconductor packaging materials play a critical role in the development of semiconductor devices. They not only provide reliable protection and support, but also contribute to the electrical connection between the chip and the external circuit. Among many choices of packaging materials, polymer‐based nanocomposites have become the mainstream candidate due to their low cost, easy processability, and tunable properties. Materials with low dielectric constant and dielectric loss, high glass transition temperature, fast thermal conductivity, suitable coefficient of thermal expansion, low viscosity, and good processability are commonly required in semiconductor packaging, yet most polymers do not meet these criteria. Therefore, modulation of the polymer matrix, introduction of suitable fillers, and modification of the filler surface are often effective approaches to enhance the performance of the composites. Here, the authors first review current research progresses of polymer‐based nanocomposites for five different types of packaging applications, namely moulding compounds, thermal interface materials, underfills, die attach materials, and substrates. The authors then present prospects of developing next‐generation polymer‐based nanocomposites for advanced semiconductor packaging and propose some suggestions to solve the existing challenges.

Curing Behavior and Properties of Active Ester Cured Cycloaliphatic Epoxy Resins

“…19,20 However, increased polarity and moisture absorption rates resulting from this can adversely impact dielectric properties, rendering such materials unsuitable for high-performance electronic packaging materials. 20,21 The introduction of an epoxy hardener offers a unique pathway. 20 The catalyst 4dimethylaminopyridine (DMAP) facilitates the reaction between epoxy and the active ester, resulting in the opening of the ring to produce ether and ester without generating hydroxyl groups.…”

“…Cross-linked epoxy resin, a type of thermoset resin, forms a three-dimensional network structure upon curing epoxy with hardeners such as anhydrides and amines . The reaction between epoxy and these hardeners generates hydroxyl groups, potentially enhancing the material’s overall polarity. , However, increased polarity and moisture absorption rates resulting from this can adversely impact dielectric properties, rendering such materials unsuitable for high-performance electronic packaging materials. , The introduction of an active ester, characterized by the Ph–O–CO– structure, as an epoxy hardener offers a unique pathway . The catalyst 4-dimethylaminopyridine (DMAP) facilitates the reaction between epoxy and the active ester, resulting in the opening of the ring to produce ether and ester without generating hydroxyl groups. , This reaction pathway is highly advantageous for developing materials exhibiting excellent dielectric properties and low hygroscopicity, despite research on the interaction between active ester and epoxy dating back to 1988–1994 by Nishikubo et al, − with limited subsequent studies on the matter.…”

Thermally conductive high‐voltage insulation composites with outstanding comprehensive properties through particle grading design

“…Thermally conductive insulating polymers show great potential in the fields of high-voltage insulation (electrical and automotive) and encapsulation of electronic devices. [1][2][3][4] In recent years, as the voltage levels of electrical equipment continue to increase and the high level of integration and miniaturization of electronic devices, polymer materials with high TC and excellent insulation are in greater demand. 2,5,6 Thermal conductivity (TC) is essential for polymer insulation materials working at high voltage and high frequency.…”