2010
DOI: 10.1109/tepm.2010.2044887
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Advanced Package Prototyping Using Nano-Particle Silver Printed Interconnects

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Cited by 16 publications
(7 citation statements)
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“…The technique is suitable for printing conductors, semiconductors, and dielectrics. As a consequence, there has been recent interest in using the method for a variety of applications, including printing of transistors, strain gauges, interconnects, electrode arrays, solid oxide fuel cells, , and solar cells. , …”
Section: Introductionmentioning
confidence: 99%
See 1 more Smart Citation
“…The technique is suitable for printing conductors, semiconductors, and dielectrics. As a consequence, there has been recent interest in using the method for a variety of applications, including printing of transistors, strain gauges, interconnects, electrode arrays, solid oxide fuel cells, , and solar cells. , …”
Section: Introductionmentioning
confidence: 99%
“…The technique is suitable for printing conductors, semiconductors, and dielectrics. As a consequence, there has been recent interest in using the method for a variety of applications, including printing of transistors, 10−14 strain gauges, 15 interconnects, 16 electrode arrays, 17 solid oxide fuel cells, 18,19 and solar cells. 6,20−24 Although most of the past reports demonstrate the technique's applicability, there are very few studies examining the factors that affect the printing quality.…”
Section: Introductionmentioning
confidence: 99%
“…The convective heat transfer rate of AISI 410 stainless steel also increased by 21%. Joo and Baldwin [67] developed an embedded-active approach for micro-system packaging to reduce manufacturing costs, lead time, and process complexity. RP of a micro-system packaging was achieved through a data-driven chip-first packaging process using direct printing of metal nanoparticles.…”
Section: Stainless Steel-based Alloysmentioning
confidence: 99%
“…Silver nanoparticles are famous for high ductility [1], high thermal conductivity [2], high electric conductivity [3], and low sintering temperature [4]. It used to improve wireless transmission [5], and it is widely applied in antimicrobial biomaterials for the treatment or prevention of bacterial infections [6, 7].…”
Section: Introductionmentioning
confidence: 99%