Advanced QFN packaging for low cost and solution

Cj, Bill; Hu, Bruce; Lin, Mark W.; Lin, T.Y.; Lee, Sunny; Lai, Yi‐Shao; Tseng, Andy

doi:10.1109/icept.2010.5582373

Cited by 15 publications

(4 citation statements)

References 3 publications

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“…There are two major processes: A. Ni/Pd/Au layer fabrication by lithography B. Copper traces and pads definition by topside half [5]. Figure 1 shows the lead frame construction with copper trace design.…”

Section: Package Feature and Process Flowmentioning

confidence: 99%

“…Bill et al [5] proposed advanced QFN package (aQFN) which is capable of providing more I/O counts than QFN or DRQFN package because the max rows can reach to be 6 rows. For example, 5 mm x 5 mm QFN package has 32 L, and then aQFN package can have 56L under the condition of 0.5 mm pitch and the same package size.…”

Section: Introductionmentioning

confidence: 99%

“…Many researches have been devoted to increase the I/O count of QFN package [1][2][3][4][5][6]. The Dual Row QFN (DRQFN) package with two row lead fingers is an enhanced version of conventional QFN [1][2].…”

Section: Introductionmentioning

confidence: 99%

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Advanced QFN packaging with trace routing design

Tsai

Chen

et al. 2014

2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

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In this paper, a lead frame package with trace routing capability is proposed for advanced QFN package that has copper traces to connect with pads or dies, called routable aQFN package. Four packages were conducted to evaluate the trace routing capability. The first is wire bond type 11 mm x 11 mm 141 I/Os package with trace fan-out designs. The second is wire bond type 3.2 mm x 3.2 mm 48 I/Os package with trace fan-in designs. The third is flip chip bond type 8 mm x 8 mm package 288 I/Os with the combination of the trace fan-in and fan-out design. The last is flip chip bond type 6 mm x 6 mm package 25 I/Os with three dies by trace routing to connect die with die and under developing. Compared to aQFN package, a significant improvement in increasing I/Os, reducing wire sweep risk and be more flexible bond layer-out design can be obtained by choosing wire bond type routable aQFN. There are major advantages of flip chip type routable aQFN: more I/Os, multidies package and finer pitch bump layer-out. Currently, the trace routing capability is that 0.5mm pitch can escape 2 traces between pad and pad. The minimum line width and trace space is 50 um and 100 um, respectively.

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Section: Package Feature and Process Flowmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Advanced QFN packaging with trace routing design

Tsai

Chen

et al. 2014

2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

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“…Several new processes for advanced QFN packages were also developed [4][5]. In this paper, we presented the recent development of Area Array QFN, i. e., AAQFN packages with maximum 441 pin counts.…”

Section: Introductionmentioning

confidence: 99%

The process development and reliability study of low cost Area Array QFN packaging technology

Wang¹,

Li²,

Ma³

et al. 2014

2014 Joint IEEE International Symposium on the Applications of Ferroelectric, International Workshop on Acoustic Transduction M

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In this paper, the fabrication process of Area Array Quad Flat No-lead (AA QFN) packages was developed. The developed AAQFN128L, AAQFN256L, and AAQFN441L packages were presented in the paper with the pin counts of 128, 256 and 441, and the package size was 10x10, 15x15 and 13x13mm respectively. The reliability of AAQFN was studied extensively. And at the same time, the comparison of the mechanical, thermal properties and the cost of BGA and AAQFN packages were made with the same pin counts of 256. It was found that the AAQFN packages have better warpage compared with BGA. The warpage value of AAQFN is 48.6 m which is smaller than that of BGA with a warpage value of 130.6 m. However, the thermal property of AAQFN was not good. The adding of solder balls on the high temperature area was proposed to achieve the similar thermal performance with BGA package. The developed AAQFN packages have excellent reliability. It can easily pass the MSL3 reliability tests.

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Electronic Packaging: Lead Frame Materials ☆

Breedis

2017

Reference Module in Materials Science and Materials Engineering

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Advanced QFN packaging for low cost and solution

Cited by 15 publications

References 3 publications

Advanced QFN packaging with trace routing design

Advanced QFN packaging with trace routing design

The process development and reliability study of low cost Area Array QFN packaging technology

Electronic Packaging: Lead Frame Materials ☆

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