Advanced Techniques in TEM Specimen Preparation

Li, Jian

doi:10.5772/37388

Cited by 4 publications

(3 citation statements)

References 23 publications

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“…FIB assisted cross sectional SEM micrographs from layers electroplated at 20 A/dm 2 under silent as well as under 53 mW/cm 3 ultrasonic power density are displayed in Figure 7. It has been reported that materials having hexagonal crystallographic structure such as Zn are prone to develop artifacts such as 'curtain effects' and material redeposition (formation of protuberances at some zones of the material) during ion-beam milling [28,29]. In this case, despite the use of protective Pt layers (to minimize any damage to the layer during the ion-beam milling process), it was not possible to avoid at all those artifacts.…”

Section: Effect Of Ultrasound On Tio 2 Particle Incorporationmentioning

confidence: 99%

Ultrasound assisted electrodeposition of Zn and Zn-TiO2 coatings

Camargo

Tudela

Schmidt

et al. 2016

Electrochimica Acta

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Section: Effect Of Ultrasound On Tio 2 Particle Incorporationmentioning

confidence: 99%

Ultrasound assisted electrodeposition of Zn and Zn-TiO2 coatings

Camargo

Tudela

Schmidt

et al. 2016

Electrochimica Acta

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“…In addition, the material can undergo a crystalline-to-amorphous/phase transition when the number of accumulated defects or the critical amount of deposited energy exceeds a threshold value. [68][69][70][71][72][73] To minimize the heating induced artifacts due to continuous transfer of kinetic energy of ions to the target materials, either cooling the specimen using a liquid nitrogen stage, or employing the ion beam modulation feature in which the sample is not exposed to the ion beam continuously, is applied. [74] The reduction of ion energy (accelerating voltage below 2 keV) and milling angles, for bulk specimen milling, minimizes ion beam damage, formation of amorphous layer and specimen heating, and low angles of incidence facilitate uniform thinning of dissimilar materials.…”

Section: Site-specific Bulk Preparationmentioning

confidence: 99%

On the role of transmission electron microscopy for precipitation analysis in metallic materials

Zhou

Babu

Hou

et al. 2021

Critical Reviews in Solid State and Materials Sciences

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Precipitation hardening is one of the most important strengthening mechanisms in metallic materials, and thus, controlling precipitation is often critical in optimizing mechanical performance. Also other performance requirements such as functional and degradation properties are critically depending on precipitation. Control of precipitation in metallic materials is, thus, vital, and the approach presently in the limelight for this purpose is an integrated approach of theory, computations and experimental characterization. An empirical understanding is essential to build physical models upon and, furthermore, quantitative experimental data is needed to build databases and to calibrate the models. The most versatile tool for precipitation characterization is the transmission electron microscope (TEM). The TEM has sufficient resolving power to image even the finest precipitates, and with TEMbased microanalysis, overall quantitative data such as particle size distribution, volume fraction and number density of particles can be gathered. Moreover, details of precipitate structure, morphology and chemistry, can be revealed. TEM-based postmortem and in situ analysis of precipitation has made significant progress over the last decade, largely stimulated by the widespread application of aberration corrected microscopes and accompanying novel analytics. The purpose of this report is to review these recent developments in precipitation analysis methodology, including sample preparation. Application examples are provided for precipitation analysis in metals, and future prospects are discussed.

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“…Sandireddy and Jiang [100] compared various silicon wafer-thinning techniques and found by TEM measurements that the SSD depths after backgrinding, backgrinding + poligrind, and backgrinding + chemical-mechanical polishing (CMP) were 0.2, 0.1, and 0 μm, respectively. TEM sample preparation by using focused ion beam (FIB) significantly simplifies and shortens the time for the sample preparation procedure compared to conventional TEM sample preparation techniques [60]. Another advantage of using FIB is the ability to precisely select a sample location for TEM analysis.…”

Section: B Subsurface Damagementioning

confidence: 99%

Characterization Methods for Ultrathin Wafer and Die Quality: A Review

Marks

Hassan

Cheong

2014

IEEE Trans. Compon., Packag. Manufact. Technol.

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Ultrathin silicon die is a key enabler for highperformance semiconductor devices and ultrathin packaging. The quality of ultrathin wafers and dies has a significant influence on packaging assembly yield and device reliability.The key quality characteristics of ultrathin wafers and dies are bow/warpage, total thickness variation (TTV), subsurface damage (SSD), surface roughness, and mechanical strength. Wafer and die bow/warpage cause handling and processing problems in manufacturing processes, and induce defects during various packaging assembly processes that eventually lead to device reliability issues. The wafer TTV requirement is becoming more stringent for new generations of thin and 3-D packages. SSD, surface roughness, and dicing defects have adverse effects on die mechanical strength and reliability. Therefore, characterization methods are needed for these quality characteristics to control the manufacturing processes for ultrathin wafers and dies to ensure good device performance and reliability. The following ultrathin wafer and die characterization techniques are discussed in this paper: noncontact bow/warp/TTV measurement, materialographic analysis with optical and electron microscopy, high-resolution X-ray diffraction, micro-Raman spectroscopy, scanning infrared depolarization, optical profilometry, atomic force microscopy, and uniaxial/biaxial bending tests.Index Terms-Bow, die mechanical strength, subsurface damage (SSD), surface roughness, total thickness variation (TTV), ultrathin die, ultrathin wafer, warpage.

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Advanced Techniques in TEM Specimen Preparation

Cited by 4 publications

References 23 publications

Ultrasound assisted electrodeposition of Zn and Zn-TiO2 coatings

Ultrasound assisted electrodeposition of Zn and Zn-TiO2 coatings

On the role of transmission electron microscopy for precipitation analysis in metallic materials

Characterization Methods for Ultrathin Wafer and Die Quality: A Review

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