Advancement in modeling vapor pressure induced stresses in electronic packaging

Abstract

Reliability defect associated humidity environment is not a new issue in m packaging. Moisture entrapment causes localiz build up and leads to pop-corning or delamina structures when subjected reflow temperatur assumed that moisture entrapped inside the po in saturated vapor state where vapor pressur 5MPa at 260˚C which may and may not c stress field change that leads to catastro approach proposed here utilized the Pressur Temperature (P-v-T) properties of water to det the water properties and corresponding vapor This open up the possibility that the pressure higher than 5MPa which can potentially expla failure such as pop-corning. The modeling fr sequential moisture diffusion analysis and st custom subroutine to incorporate vapor pressu finite element computation. Two case studies feasibility of this advance methodology to d mechanism. Keywords-moisture diffusion; vapor pr electronic packaging;I.

Influence of moisture concentration and hydrophobic material on induced stress in FCBGA package under reflow

“…The vapor pressure of TV2 achieved the maximum of 4.07 MPa throughout the reflow and this value is close to the 5 MPa obtained by Xie et al (2009b) for the simulated package. However, Keat et al (2015) suggested some possibilities that the vapor pressure can further grow and develop into a superheated state beyond saturation.…”

“…Finally, the FSI effect of moisture diffusion on electronic packaging was examined by coupling the moisture-induced stress with thermal mechanical stress for TV2 structural analysis. Comparison results between reference bi-model from (Keat et al, 2015) are shown in Table 3. As shown in Figure 24, the FSI results revealed maximum stress of 247 MPa, which is reasonably larger than the 115 MPa obtained by Keat et al (2015) for a bi-material.…”

“…Comparison results between reference bi-model from (Keat et al, 2015) are shown in Table 3. As shown in Figure 24, the FSI results revealed maximum stress of 247 MPa, which is reasonably larger than the 115 MPa obtained by Keat et al (2015) for a bi-material. For an electronic packaging with a hydrophilic material, the maximum stress should be larger than that for the bi-material.…”