Reliability defect associated humidity environment is not a new issue in m packaging. Moisture entrapment causes localiz build up and leads to pop-corning or delamina structures when subjected reflow temperatur assumed that moisture entrapped inside the po in saturated vapor state where vapor pressur 5MPa at 260˚C which may and may not c stress field change that leads to catastro approach proposed here utilized the Pressur Temperature (P-v-T) properties of water to det the water properties and corresponding vapor This open up the possibility that the pressure higher than 5MPa which can potentially expla failure such as pop-corning. The modeling fr sequential moisture diffusion analysis and st custom subroutine to incorporate vapor pressu finite element computation. Two case studies feasibility of this advance methodology to d mechanism. Keywords-moisture diffusion; vapor pr electronic packaging;I.

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