2015 20th IEEE European Test Symposium (ETS) 2015
DOI: 10.1109/ets.2015.7138758
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Advancements in diagnosis driven yield analysis (DDYA): A survey of state-of-the-art scan diagnosis and yield analysis technologies

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Cited by 14 publications
(5 citation statements)
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“…In [17], authors improve on-chip diagnosis resolution with a modified k-nearest neighbors classifier that is updated with real-time failure data. In [18], volume diagnosis resolution is improved with a Bayesian classifier that identifies the actual candidates based on their layout properties. In [19], authors present a novel yield optimization methodology based on establishing a strong correlation between a group of fails and an adjustable process parameter.…”
Section: State Of the Art And Motivationsmentioning
confidence: 99%
“…In [17], authors improve on-chip diagnosis resolution with a modified k-nearest neighbors classifier that is updated with real-time failure data. In [18], volume diagnosis resolution is improved with a Bayesian classifier that identifies the actual candidates based on their layout properties. In [19], authors present a novel yield optimization methodology based on establishing a strong correlation between a group of fails and an adjustable process parameter.…”
Section: State Of the Art And Motivationsmentioning
confidence: 99%
“…In [16], authors improve on-chip diagnosis resolution with a modified k-nearest neighbors classifier that is updated with real-time failure data. In [17], volume diagnosis resolution is improved with a Bayesian classifier that identifies the actual candidates based on their layout properties. In [18], authors present a novel yield optimization methodology based on establishing a strong correlation between a group of fails and an adjustable process parameter.…”
Section: State Of the Art And Motivationsmentioning
confidence: 99%
“…Especially with the advent of very deep submicron technologies (i.e., 7 nm), a high resolution (very few or one candidate) is not always reachable by existing CA logic diagnosis tools based on conventional methods [8]. For this reason, considerable efforts have been spent on improving resolution by using machine learning techniques, mainly through the extraction of features that allow correct candidates (those that correctly represent defect locations) to be distinguished from incorrect ones [2,4,9,10,11].…”
Section: Introductionmentioning
confidence: 99%