Advancements in the identification of passive RC networks for compact modeling of thermal effects in electronic devices and systems

Abstract

We deal with the problem of identifying the parameters of an equivalent lumped RC multiport network from time domain tabulated data of a corresponding distributed real eigenvalues problem, as obtained from either measurements or accurate simulation tools. A novel step response matrix identification procedure is proposed, based on the combination of an outer nonlinear least squares iteration for the relocation of time constants, and an inner convex programming cycle for the identification of the corresponding residue matrix terms, able to guarantee a priori the passivity property of the equivalent RC network. The structure of the algorithm and its principal functions connections are shown, and the mathematical features of the proposed formulation of the identification problem are accurately described and commented. Moreover, the possibility of getting direct synthesis of a Foster generalized concretely passive multiport, as a consequence of the optimal identification of a passive real eigenvalues model from data, is discussed. Since the technique is well suited (although not limited) to the reduced analysis of typical electro‐thermal problems, a set of significant case studies in this area is considered. In this way the algorithm present implementation is validated, also comparing it to previous well assessed methods, evidencing its large potential and value.

Experimental Study of Thermal Management Characteristics of Mass via Arrays

“…Our prior work removed the time-dependent components-heat capacity-from a generalized one-dimensional model of an MVA [19]. While a time-dependent model can be a valuable tool for determining a thermal management structure's ability to resist thermal excursions and other unpredictable thermal phenomena, those models rely only on the steady-state behavior of MVAs to determine baseline performance criteria [23,24]. While this technique is used for MVAs with solid-core vias, the same technique can be extended to an equivalent PCB-based system.…”

“…As such, similar variance in the measured heat spreading metrics of the fabricated MVAs can be expected. These values were integrated into the FCS model from [10,24,25] and were simulated over 101 FCS iterations. The variance of the heat distribution was calculated for each temperature profile to act as a baseline for comparison against the measured results.…”

Transient Thermal Analysis of the Circuit Breaker Current Path with the Use of FEA Simulation

“…As mentioned, research works in the field of modular electrical devices are carried out, some of them quite advanced. The authors present dynamic voltage models [31,32] and CFD models [33][34][35][36][37][38][39].…”

Thermal Analysis of Heat Distribution in Busbars during Rated Current Flow in Low-Voltage Industrial Switchgear

“…In addition, using coupled analyses: Maxwell 3D, Fluent CFD, Transient Thermal, allowing for an accurate temperature distribution on the busbars and inside the switchgear [28][29][30][31]. This type of calculation allows the structure to be optimized in terms of high temperature resistance, as well as heat dissipation from the switchgear to the environment [32][33][34][35][36][37]. The novelty of the approach is clearly the cost reduction concerning expensive experimental research and also the ability to reduce materials quantities that ought to be used for switchgear assembly.…”