Advances in arrayed microcolumn lithography

Abstract

A microcolumn array has been designed, fabricated, and tested. The 2ϫ2 array has a 2 cm pitch and operates at 1 keV. Key components include vertical interconnects, silicon low-distortion octupole deflectors, miniature long-range flexure-based tip positioners, and low-power thermal field emitters. Initial results show no observable crosstalk between columns during simultaneous operation at a 50 MHz beam blanking rate. Preliminary lithography results are presented.

Parallel electron-beam-induced deposition using a multi-beam scanning electron microscope

“…However, in order to enhance the throughput, one could write with many electron beams in parallel. Several authors have proposed and/or built such multibeam lithography systems, [7][8][9][10][11][12][13][14][15][16][17][18][19][20] which can be divided roughly into four types: (i) multiple optical columns with multiple sources, [10][11][12] (ii) single column with multiple sources, [13][14][15] (iii) single column with single source, [16][17][18][19][20][21][22] and (iv) multiple cold field emitters in close proximity to the wafer. 23 Although the latter system seems attractive, because it does not require any optics, it has not been demonstrated yet.…”

Arrayed microcolumn operation with a wafer-scale Einzel lens

“…Recently, microcolumn was demonstrated as a promising technology for the next generation lithography with high resolution and high throughput capabilities [1][2][3][4][5][6]. The experimental result achieved with a 1 keV low-energy microcolumn proved the probe beam diameter of 10 nm with a beam current of $1 nA at a working distance of 1 mm [1].…”

“…The experimental result achieved with a 1 keV low-energy microcolumn proved the probe beam diameter of 10 nm with a beam current of $1 nA at a working distance of 1 mm [1]. Arrayed microcolumn operation was also proposed and demonstrated for sub-100 nm lithography [2][3][4]. It is reported that multi-beam microcolumn can offer the throughput of 25 wafers per hour (WPH) on 300 mm wafer with 50 nm patterning resolution [3].…”

“…Arrayed microcolumn operation was also proposed and demonstrated for sub-100 nm lithography [2][3][4]. It is reported that multi-beam microcolumn can offer the throughput of 25 wafers per hour (WPH) on 300 mm wafer with 50 nm patterning resolution [3]. This would be more effective than EUVL in the view of investments of the cost of ownership and production facilities [7].…”

“…The arrayed microcolumn structure can be categorized by three ways: combination of single column modules (SCM), monolithic column module (MCM), and wafer-scale column module (WCM) [2]. In previous work, microcolumn operation as an array of SCM has been demonstrated, which showed the possibility of practical application of microcolumn for future application as a high throughput lithography system [3]. However, it is really difficult to assemble arrayed SCM structure and for the practical fabrication of arrayed microcolumn, the components should be fabricated using wafer-scale MEMS technology.…”