Advances in Joining and Welding Technologies for Automotive and Electronic Applications

Abstract

The joining of various parts in engineering applications such as automotive components, aircrafts, medical implants, sensor devices, interconnections etc., are a great concern nowadays. Various types of low melting point fillers, braze and alloys have been also developed but problem of crack generation and failures are not satisfactorily treated. This paper reviews some of the developments in traditional and modern joining techniques in automotive joining and welding. Currently, joining of composites is attracting researchers for weight reduction and economy. There are many practical techniques for joining metals and ceramics to themselves and to dissimilar materials. An overview of various processes of joining metal-metal, ceramic-metal and composites, factors affecting joining and approaches used to improve the brazed joint structures are presented here. In addition, new modifications in welding and brazing processes are outlined for further directions.

Recent Progress in Transient Liquid Phase and Wire Bonding Technologies for Power Electronics

“…There are many different types of joining processes. According to the established research, classification of joining processes can be summarized as shown in Figure 2 [11,27]. Different joining processes are divided into fusion welding, solid-state bonding, and soldering.…”

“…The fusion welding methods, including the well-known arc welding, flame welding, laser welding, and electron beam welding, operate at even much higher temperatures. Diffusion bonding, ultrasonic bonding, and friction bonding are typical examples of the solid-state bonding method [11,27,28]. Among the solid-state bonding methods, the diffusion bonding method is one of the basic bonding methods, where a mutual diffusion occurs in the solid-state between atoms across both sides to be joined by applying pressure and/or high bonding temperature close to the bonding surface [28,29].…”

High-Entropy Alloys for Micro- and Nanojoining Applications

“…Since metals are soft and malleable, for various functional applications, their joining is needed in semiconductors. There are various types of filler materials already available, such as Ag-Cu-Ti brazing system which is most suitable in metal-ceramic joining [7,14].…”

Alternative technology to manufacture bimetallic products by using self-propagating high temperature synthesis

“…In technology, termites are commonly referred to as powder mixtures of metals with metal oxides, the combustion of which generates a large amount of heat and results a high heating temperature, forms a melt from reaction products and powders of metallic filler [1][2][3][4][5].…”

“…Heat flow of a reaction is sufficient to heat the thermite surfacing alloy up to 3 134 K ( the boiling point of iron) [4].…”