Advances in large-format visible focal plane technology

Abstract

Finer geometry and sophisticated circuit design reduce the size and power of focal plane array detectors for a range of imaging applications, while lowering costs and increasing operability.

Applications Driving Adoption of Direct Bond Technology

“…Significant cost reductions of about 30% have been projected for this next generation BSI CMOS image sensor compared to that available today using direct bonding without a scalable integral interconnect due to CMOS and die size savings (24). This type of 3D image sensor technology has previously been used to fabricate large format focal plane arrays (25) and consumer format BSI CMOS image sensors using nickel DBI® (26). More recently, a copper DBI® process that leverages industry standard copper damascene technology has been used to build a 3D BSI CMOS image sensor with a 3D interconnect pitch less than two microns.…”