Advances in thermoelectric devices for localized cooling

Sun, Wei; Liu, Wei‐Di; Li, Qingfeng; Chen, Zhigang

doi:10.1016/j.cej.2022.138389

Cited by 68 publications

(23 citation statements)

References 138 publications

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“…Thermoelectric (TE) materials are attracting increasing attention in the materials research community as they allow for the direct conversion of waste heat into electricity, thereby improving the overall efficiency of power generation [ 1 , 2 , 3 , 4 ]. Typically, thermoelectric devices have been so far based on inorganic compounds, but also hybrid (organic-inorganic) TE materials have recently attracted the attention of many, in both the academic and industrial fields [ 5 , 6 , 7 , 8 , 9 ].…”

Section: Introductionmentioning

confidence: 99%

Long-Term Stability of TiS2–Alkylamine Hybrid Materials

et al. 2022

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Layered TiS2 intercalated with linear alkylamines has recently attracted significant interest as a model compound for flexible n-type thermoelectric applications, showing remarkably high power factors at room temperature. The thermal and, particularly, environmental stability of such materials is, however, a still an open challenge. In this paper, we show that amine-intercalated TiS2 prepared by a simple mechanochemical process is prone to chemical decomposition through sulfur exsolution, and that the presence of molecular oxygen is likely to mediate the decomposition reaction. Through computational analysis of the possible reaction pathways, we propose that Ti-N adducts are formed as a consequence of amine groups substituting for S vacancies on the internal surfaces of the S-Ti-S layers. These findings provide insights for possible future applications of similar hybrid compounds as devices operating in ambient conditions, and suggest isolating them from atmospheric oxygen.

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Section: Introductionmentioning

confidence: 99%

Long-Term Stability of TiS2–Alkylamine Hybrid Materials

et al. 2022

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“…[4][5][6] As can be seen, high-performance thermoelectric materials need both excellent electrical transport properties (evaluated by the power factor, S 2 σ) and low κ. Additionally, thermoelectric materials need high zT in a wide temperature range, which can be indexed by average zT (zT ave ) and determines η at the entire applicational temperature range. [7,8] High-performance thermoelectric materials are narrow bandgap semiconductors, such as PbTe [9] and Bi 2 Te 3 . [10] However, poor mechanical properties or high toxicity of these materials limit their extensive applications.…”

Section: Introductionmentioning

confidence: 99%

Interstitial Cu: An Effective Strategy for High Carrier Mobility and High Thermoelectric Performance in GeTe

Yin

Liu

et al. 2023

Adv Funct Materials

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Dense point defects can strengthen phonon scattering to reduce the lattice thermal conductivity and induce outstanding thermoelectric performance in GeTe‐based materials. However, extra point defects inevitably enlarge carrier scattering and deteriorate carrier mobility. Herein, it is found that the interstitial Cu in GeTe can result in synergistic effects, which include: 1) strengthened phonon scattering, leading to ultralow lattice thermal conductivity of 0.48 W m−1 K−1 at 623 K; 2) weakened carrier scattering, contributing to high carrier mobility of 80 cm2 V−1 s−1 at 300 K; 3) optimized carrier concentration of 1.22 × 1020 cm−3. Correspondingly, a high figure‐of‐merit of ≈2.3 at 623 K can be obtained in the Ge0.93Ti0.01Bi0.06Te‐0.01Cu, which corresponds to a maximum energy conversion efficiency of ≈10% at a temperature difference of 423 K. This study systematically investigates the doping behavior of the interstitial Cu in GeTe‐based thermoelectric materials for the first time and demonstrates that the localized interstitial Cu is a new strategy to enhance the thermoelectric performance of GeTe‐based thermoelectric materials.

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“…The n-type and p-type TE legs are electrically connected in series by Cu electrodes and conduct heat in parallel. Owing to the compact structure, TE devices have no mechanical moving part, no noise, and no harmful gas release. − Nowadays, Bi 2 Te 3 -based TE devices have been the most successful commercialized devices because of the excellent TE performance and productibility of Bi 2 Te 3 -based alloys. , However, because of the brittle feature of Bi 2 Te 3 -based ingots and the weak bond between TE legs and electrodes, TE devices are still very fragile. − In particular, if the working temperature is unusually high, for example, when subjected to an unexpected high-temperature heat source or heat stack from inefficient heat dissipation, the devices could be destroyed with severe thermal damage. , …”

Section: Introductionmentioning

confidence: 99%

Enhanced Contact Performance and Thermal Tolerance of Ni/Bi₂Te₃ Joints for Bi₂Te₃-Based Thermoelectric Devices

Zhang

Wei

Zhang

et al. 2023

ACS Appl. Mater. Interfaces

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Ni metal has been widely used as a barrier layer in Bi2Te3-based thermoelectric devices, which establishes stable joints to link Bi2Te3-based legs and electrodes. However, the Ni/Bi2Te3 joints become very fragile when the devices were exposed to high temperature, causing severe performance deterioration and even device failure. Herein, stable Ni/Bi2Te3 joints have been established by arc spraying of the Ni barrier layer on the Bi2Te3-based alloys. The interface microstructure and contact performance including the bonding strength and contact resistivity of the arc-sprayed Ni/Bi2Te3 joints are investigated. The results indicate that, as compared with traditional Ni/Bi2Te3 joints, the arc-sprayed Ni/Bi2Te3 joints have comparably low contact resistivity while possessing a 50% higher bonding strength. Aging the joints as an exposure to high-temperature circumstances, the arc-sprayed Ni/Bi2Te3 joints exhibit much better tolerance to the thermal shock with stable bonding strength and contact resistivity. The enhanced interfacial contact performance and thermal tolerance should be attributed to the thick Ni barrier layer and interface reaction layer with good Ohmic contact. This work provides an effective strategy to establish stable joints for the Bi2Te3-based thermoelectric devices with improved thermal stability.

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Advances in thermoelectric devices for localized cooling

Cited by 68 publications

References 138 publications

Long-Term Stability of TiS2–Alkylamine Hybrid Materials

Long-Term Stability of TiS2–Alkylamine Hybrid Materials

Interstitial Cu: An Effective Strategy for High Carrier Mobility and High Thermoelectric Performance in GeTe

Enhanced Contact Performance and Thermal Tolerance of Ni/Bi₂Te₃ Joints for Bi₂Te₃-Based Thermoelectric Devices

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Advances in thermoelectric devices for localized cooling

Cited by 68 publications

References 138 publications

Long-Term Stability of TiS2–Alkylamine Hybrid Materials

Long-Term Stability of TiS2–Alkylamine Hybrid Materials

Interstitial Cu: An Effective Strategy for High Carrier Mobility and High Thermoelectric Performance in GeTe

Enhanced Contact Performance and Thermal Tolerance of Ni/Bi2Te3 Joints for Bi2Te3-Based Thermoelectric Devices

Contact Info

Product

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Enhanced Contact Performance and Thermal Tolerance of Ni/Bi₂Te₃ Joints for Bi₂Te₃-Based Thermoelectric Devices