Aero Acoustic MEMS Microphone Integration in Ultra-Thin and Flexible Substrate

Erbacher, Kolja; Marques, Joao Alves; Krshiwoblozki, Malte von; Wu, Lixiang; Ngo, Ha-Duong; Schneider-Ramelow, Martin

doi:10.1109/eptc56328.2022.10013281

Cited by 4 publications

(2 citation statements)

References 8 publications

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“…The sensors and the front-end conditioning are performed on flex printed circuits [11], and the amplification and filtering stages, along with the multiplexing stages of the signals, are performed on rigid PCBs (Fig. 1), so the integrated circuits (IC) chosen are optimized for size and versatility.…”

Section: Integration Of Mems Microphone Arraysmentioning

confidence: 99%

Electronics for Piezoelectric Mems Microphone Arrays Applied to Aero-Acoustic Characterization of Structures in Wind Tunnel Tests

Báez,

García-Souto,

Cavarischia

et al. 2023

10th ECCOMAS Thematic Conference on Smart Structures and Materials

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The electronic instrumentation system for a MEMS microphone array for wind tunnel tests (WTT) is presented: the array on a flexible PCB, the integration with the frontend electronics, the selection of components, the characterization of the electronics and the multiplexing strategy to concentrate analog channels in the data acquisition system (DAQ). This work is carried out in the framework of the Aeromic project, with new piezoelectric MEMS dual frequency LF (30 kHz resonance) and HF (200 kHz resonance) sensors. The front-end and signal conditioning are based on commercial components, including integrated circuits for amplification and buffering, filtering, sample & hold, and multiplexing. The design and characterization of these electronic components are discussed. A modular design based on an 8-microphone array focuses on 4 analog channels of the DAQ through 8 analog multiplexers which is scalable to 80 sensors.

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Section: Integration Of Mems Microphone Arraysmentioning

confidence: 99%

Electronics for Piezoelectric Mems Microphone Arrays Applied to Aero-Acoustic Characterization of Structures in Wind Tunnel Tests

Báez,

García-Souto,

Cavarischia

et al. 2023

10th ECCOMAS Thematic Conference on Smart Structures and Materials

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“…Unfortunately, these sensors are not available on the open market. The author of this paper has presented an approach of a custom MEMS microphone for flight tests, combined with a packaging approach using through silicon vias (TSVs) [6]. As this approach is combined with a high effort in the fabrication of the MEMS chip and the packaging of the chip, we present a concept that allows the flush mounted integration of the custom MEMS microphone described in [7] into a conventional printed circuit board (PCB).…”

Section: Introductionmentioning

confidence: 99%

A Flush Mount Packaging Concept for a Mems Microphone Array for Aero-Acoustic Measurements

Erbacher,

Bourquard,

Julliard

2023

10th ECCOMAS Thematic Conference on Smart Structures and Materials

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This paper presents a new approach to package a MEMS microphone for flight tests on airplanes for noise measurements. The package consists of a conventional thinned printed circuit board (PCB) with a cavity, in which the sensor chip is attached. The electrical connections are done with very shallow wire-bonds and the cavity is then sealed with a soft silicone gel. First a brief introduction on the measurement of noise in flight tests is given, followed by the measurement scenario addressed in this paper. The most common packaging approach for MEMS microphones is explained and a new concept for thinner and smaller sensor systems is presented, followed by testing procedures.

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Electronics design of piezo-resistive MEMS microphone arrays for aero-acoustics in flight tests

García-Souto,

Báez-Rivera,

Erbacher

et al. 2023

2023 Symposium on Design, Test, Integration &Amp; Packaging of MEMS/MOEMS (DTIP)

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Aero Acoustic MEMS Microphone Integration in Ultra-Thin and Flexible Substrate

Cited by 4 publications

References 8 publications

Electronics for Piezoelectric Mems Microphone Arrays Applied to Aero-Acoustic Characterization of Structures in Wind Tunnel Tests

Electronics for Piezoelectric Mems Microphone Arrays Applied to Aero-Acoustic Characterization of Structures in Wind Tunnel Tests

A Flush Mount Packaging Concept for a Mems Microphone Array for Aero-Acoustic Measurements

Electronics design of piezo-resistive MEMS microphone arrays for aero-acoustics in flight tests

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