Aging effects of Epoxy Moulding Compound on the long-term stability of plastic package

Nguegang, Eric; Franz, J.; Kretschmann, A.; Sandmaier, H.

doi:10.1109/esime.2010.5464615

Cited by 11 publications

(2 citation statements)

References 3 publications

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“…EMC protects electronic components and systems from various environmental conditions such as mechanical shock, chemical loads, heat, and moisture [1]. EMC is a composite material consisting of epoxy resin as the matrix, silica as the filler material, hardeners, and other additives [2]. The cross-linking reaction between epoxy resin and hardeners forms the thermosetting polymer.…”

Section: Thermal Aging Of Epoxy Molding Compoundmentioning

confidence: 99%

EMC Oxidation Under High-Temperature Aging

Inamdar

Gromala

Prisacaru

et al. 2022

Reliability of Organic Compounds in Microelectronics and Optoelectronics

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Section: Thermal Aging Of Epoxy Molding Compoundmentioning

confidence: 99%

EMC Oxidation Under High-Temperature Aging

Inamdar

Gromala

Prisacaru

et al. 2022

Reliability of Organic Compounds in Microelectronics and Optoelectronics

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“…Epoxy Molding Compound (EMC) is a composite material which composes of silica fillers, epoxy resin, hardeners and other additives like flame retardant and coupling agent [1]. It is widely used to encapsulate electronic devices for protection against environmental, chemical and mechanical attacts [2].…”

Section: Introductionmentioning

confidence: 99%

The effect of thermal aging on the mechanical properties of molding compounds and the reliability of electronic packages

Yang

Cui

2011

2011 12th International Conference on Electronic Packaging Technology and High Density Packaging

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Epoxy Molding Compounds are widely used in electronic packaging as encapsulants of electronic devices. Previous research has indicated that thermal aging has great influence on the material properties of molding compounds. The thermal aging effects will certainly influence the reliability performance of the packages. It is very necessary to study the effect of thermal aging on the mechanical properties of molding compounds and the reliability of electronic packages.In this paper the effect of thermal aging on the mechanical properties of molding compounds and the reliability of electronic packages is presented. Experimental study of the aging effect on the mechanical properties of the molding compounds was performed. The samples were aged at various levels of temperature and aging times. DMA and TMA were used to measure the moduli, coefficients of thermal expansion (CTE), and the glass transition temperature (Tg). It is found that thermal aging has significant influence on the rubbery modulus and the glass transition temperature (Tg). Oxidation is believed to be one of the main mechanisms for the degradation of the material properties. A numerical model was used to estimate the modulus of the oxidized layer. 3D finite element models were established to simulate the impact of the aging effect on the stress/strain of the package. The modeling results indicate that the aging of the compounds have a significant impact on the stress/strain status in the package.

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Development of Molding Compounds Based on Epoxy Resin/Aromatic Amine/Benzoxazine for High‐Temperature Electronic Packaging Applications

Gou

Bao

Huang

et al. 2022

Macro Materials & Eng

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Heat-resistant molding of compounds is an indispensable part in encapsulating future electronic power devices. Herein, it is used for polyfunctional epoxy resin (EP) and diamine-phenol benzoxazine (BOZ) as resin matrix, 4,4'-diaminodiphenylmethane (DDM) as curing agent, and iron acetylacetonate (Fe(acac) 3 ) as curing accelerator, as well as inorganic fillers and other auxiliaries, to prepare heat-resistant molding compounds. The curing behavior, processability and thermal performance of the EP/DDM/BOZ (EDB) resin blends containing different contents of DDM, BOZ, and Fe(acac) 3 are first systematically investigated. The EDB molding compounds (MC EDB ) with suitable BOZ content show good processability, and the molding process can be compatible with that of commercial epoxy molding compounds (EMC). With increasing the BOZ content, the glass transition temperature of cured MC EDB is greatly enhanced to a maximum of 261 °C determined by dynamic mechanical analyzer, owing to the hydrogen-bond interaction generated after polymerization of BOZ increasing the rigidity of network chains. Moreover, the cured MC EDB also exhibits higher thermal decomposition stability, better high-temperature (200 °C) mechanical properties, and lower water absorption compared to the cured EMC. After high-temperature (200 °C) aging for 500 h, the cured MC EDB with suitable BOZ content still maintains outstanding performance. This study provides a promising strategy for preparing heat-resistant electronic packaging molding compounds.

show abstract

Aging effects of Epoxy Moulding Compound on the long-term stability of plastic package

Cited by 11 publications

References 3 publications

EMC Oxidation Under High-Temperature Aging

EMC Oxidation Under High-Temperature Aging

The effect of thermal aging on the mechanical properties of molding compounds and the reliability of electronic packages

Development of Molding Compounds Based on Epoxy Resin/Aromatic Amine/Benzoxazine for High‐Temperature Electronic Packaging Applications

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