Aging effects on IMC formation and joint strength of low-Ag SAC solder/UBM (Ni (P)-Au) for WLCSP

Sun, Fenglian; Hochstenbach, P.; Driel, W.D. van; Zhang, G.Q.

doi:10.1109/esime.2008.4525059

Cited by 1 publication

(1 citation statement)

References 14 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…The same trend was also observed from Overall, from the data collected, in both SAC305 and Sn0.7Cu solder samples, it was generally observed that the average IMC thickness increased with aging time. Consistent with the observations reported by Sun et al (2008), this growth in the IMC thickness was promoted by HTS and can be attributed to the diffusion of Cu from the solder with time [14][15]. In addition, as demonstrated by the results of the TCG samples and HTS samples, it was observed that the average IMC thickness was larger in the HTS samples as compared to TCG samples.…”

Section: Imc Grain Orientation Comparison -Sac305 Vs Sn07cu At Time =supporting

confidence: 88%

Electron backscatter diffraction study for advanced semiconductor interconnect materials analysis

Lee¹

View full text Add to dashboard Cite

Chapter 5 is published as A. Lee, B. Zee and F.J. Foo, "Application of EBSD Study of Cu-Sn IMCs in SAC305 and Sn0.7Cu Solder Joints to Determine the Suitability of Sn0.7Cu Solder as Alternative in Mitigating ILD Cracks/Delamination," in proceedings of the 23 rd Electronics Packaging Technology Conference (EPTC), 2021.The contributions of the co-authors are as follows:• B. Zee provided the initial project direction and scope.• I co-designed the study with B. Zee.• I performed all the laboratory work at the Advanced Micro Devices, Inc (Singapore) Device Analysis Laboratory. I also analyzed the data and prepared the manuscript draft.• The manuscript was revised by B. Zee and F.J. Foo.

show abstract

Section: Imc Grain Orientation Comparison -Sac305 Vs Sn07cu At Time =supporting

confidence: 88%

Electron backscatter diffraction study for advanced semiconductor interconnect materials analysis

Lee¹

View full text Add to dashboard Cite

show abstract

Aging effects on IMC formation and joint strength of low-Ag SAC solder/UBM (Ni (P)-Au) for WLCSP

Cited by 1 publication

References 14 publications

Electron backscatter diffraction study for advanced semiconductor interconnect materials analysis

Electron backscatter diffraction study for advanced semiconductor interconnect materials analysis

Contact Info

Product

Resources

About