2014
DOI: 10.1149/2.0021411jss
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Al2O3/InGaAs Metal-Oxide-Semiconductor Interface Properties: Impact of Gd2O3and Sc2O3Interfacial Layers by Atomic Layer Deposition

Abstract: The use of InGaAs as a high carrier mobility CMOS-channel material requires a proper electrical passivation of its interface with the gate dielectric. We investigate InGaAs passivation by Atomic Layer Deposition (ALD) of Al2O3, Gd2O3, and Sc2O3 using tri-methylaluminum (TMA), (iPrCp)3Gd, (MeCp)3Sc, and H2O as precursors. We discuss the impact of the starting precursor and TMA exposure during the initial cycles of Al2O3 on the interface trap density (Dit), frequency dispersion, leakage current, and breakdown fi… Show more

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Cited by 18 publications
(12 citation statements)
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“…Note, however, that this assumption needs to be verified by a more systematic study utilizing a larger number of samples. For more details about the growth mechanisms and layer properties we refer to [ 33 ]. Our results clearly demonstrate the flexibility of our method in view of material systems and compositions.…”
Section: Resultsmentioning
confidence: 99%
“…Note, however, that this assumption needs to be verified by a more systematic study utilizing a larger number of samples. For more details about the growth mechanisms and layer properties we refer to [ 33 ]. Our results clearly demonstrate the flexibility of our method in view of material systems and compositions.…”
Section: Resultsmentioning
confidence: 99%
“…Previously, the ALD of a Sc 2 O 3 interfacial layer was examined on an InGaAs substrate with a native oxide layer using Sc­(MeCp) 3 /water at 300 °C . Interestingly, increasing the Sc­(MeCp) 3 pulse time from 4 to 10 s during the first ALD cycle resulted in higher scandium content; no indium, gallium, or arsenic oxides were detected after the application of one Sc 2 O 3 ALD cycle, suggesting efficient interfacial self-cleaning .…”
Section: Results and Discussionmentioning
confidence: 99%
“…The thicker films measured on the Si(111)−SiO 2 −OH substrates result from the direct reaction of 1 with SiO 2 at ≥225 °C, in addition to this gas-phase contribution. Because Sc 2 O 3 is not hygroscopic, 43 adsorbed water is not expected to be present on the ScSi x O y surface; consequently, gas-phase reactions are likely facilitated by water desorbed from the chamber walls.…”
Section: Resultsmentioning
confidence: 99%
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