2008
DOI: 10.1149/1.2839007
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All-Copper Chip-to-Substrate Interconnects Part I. Fabrication and Characterization

Abstract: A fabrication process has been developed and characterized to create all-copper chip-to-substrate input/output connections. Electroless copper plating followed by low-temperature annealing in a nitrogen environment was used to create an all-copper bond between copper pillars. The ability to fuse the two copper surfaces at modest temperature and pressure is demonstrated. The bond strength for the all-copper structure exceeded 165 MPa after annealing at 180°C. During the anneal process, a significant microstruct… Show more

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Cited by 39 publications
(36 citation statements)
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“…Using an anneal temperature of 180°C for 1 h in nitrogen ambient as reported previously, 10 the joints recrystallized and formed mechanically stable pillar-to-pillar bonds. Figure 8 shows two typical cross sections for joints that were successfully bonded with the 180°C annealing process, 1 h. The interface has been removed and has formed a seamless solid copper-copper bond.…”
Section: D228mentioning
confidence: 86%
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“…Using an anneal temperature of 180°C for 1 h in nitrogen ambient as reported previously, 10 the joints recrystallized and formed mechanically stable pillar-to-pillar bonds. Figure 8 shows two typical cross sections for joints that were successfully bonded with the 180°C annealing process, 1 h. The interface has been removed and has formed a seamless solid copper-copper bond.…”
Section: D228mentioning
confidence: 86%
“…A second goal of this work is to reduce the plating time required for a complete pillar-to-pillar bonding. Previously, long time periods were devoted to the room-temperature electroless deposition process, typically 18 h. 10 Increasing the temperature increased the plating rate; however, the deposit was porous and unacceptable. There are fewer parameters to manipulate in electroless deposition, compared to electrodeposition, because current and potential cannot be externally controlled.…”
Section: Journal Of the Electrochemical Society 156 ͑7͒ D226-d230 ͑2mentioning
confidence: 99%
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“…82 For solders, lower melting point materials are needed to support multiple die attach operations and minimize thermally generated strains. 83 Nano-particle solders in particular appear to be one attractive option due to the reduced melting points they exhibit resulting from their increased surface/volume ratio. 84 New polymeric materials that can meet similar requirements are also needed to serve as adhesives, molding compounds, and underfill and thermal interface materials.…”
mentioning
confidence: 99%