All hot wire chemical vapor deposition low substrate temperature transparent thin film moisture barrier

Spee, D.A.; Schipper, Merijn R.; Werf, C.H.M. van der; Rath, J.K.; Schropp, R.E.I.

doi:10.1016/j.tsf.2012.11.146

Cited by 18 publications

(7 citation statements)

References 13 publications

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“…[6][7][8] These advantages of the deposition methods contributed to the fabrication of TFEs with outstanding barrier property for the encapsulation of organic electronics. [11][12][13] The barrier properties of TFE fabricated via the iCVD/ALD, iCVD/PECVD, and iCVD/HWCVD pairs were similar to each other. [11][12][13] The barrier properties of TFE fabricated via the iCVD/ALD, iCVD/PECVD, and iCVD/HWCVD pairs were similar to each other.…”

Section: Introductionmentioning

confidence: 71%

Initiated Chemical Vapor Deposition of Polymer Films at High Process Temperature for the Fabrication of Organic/Inorganic Multilayer Thin Film Encapsulation

et al. 2017

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For the fabrication of thin film encapsulation (TFE), sequential deposition of organic and inorganic layers is inevitable. A single-chamber system of initiated chemical vapor deposition (iCVD) and atomic layer deposition (ALD) is reported previously. Here, the substrate temperature (T s ) of the iCVD is aligned with that of ALD to facilitate the transition of the deposition mode by removing delays caused by repeated heating/cooling of the substrate. While increasing the T s of iCVD from 40 to 90 C, the process pressure is optimized so that the properties of the organic film are unchanged from that deposited with 40 C. The T s alignment significantly reduced the time delay during transition of the deposition mode, and the fabrication of the TFE is expedited.

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Section: Introductionmentioning

confidence: 71%

Initiated Chemical Vapor Deposition of Polymer Films at High Process Temperature for the Fabrication of Organic/Inorganic Multilayer Thin Film Encapsulation

et al. 2017

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“…Very often the inorganic coatings cannot be deposited on soft substrates because the stress mismatch create wrinkles and cracks and the methods to deposit inorganic thin films are generally not compatible with soft substrates. Frequently, this type of polymer network is sandwiched between very thin inorganic films, in multilayer structures, to enhance the overall mechanical properties 81, 82, 83. For these reasons, the deposition of a polymer network which shows properties comparable to inorganic material, keeping tunability and flexibility is of high technological interest.…”

Section: Chain Growth Polymerization: Icvdmentioning

confidence: 99%

25th Anniversary Article: CVD Polymers: A New Paradigm for Surface Modifi cation and Device Fabrication

et al. 2013

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Well-adhered, conformal, thin (<100 nm) coatings can easily be obtained by chemical vapor deposition (CVD) for a variety of technological applications. Room temperature modification with functional polymers can be achieved on virtually any substrate: organic, inorganic, rigid, flexible, planar, three-dimensional, dense, or porous. In CVD polymerization, the monomer(s) are delivered to the surface through the vapor phase and then undergo simultaneous polymerization and thin film formation. By eliminating the need to dissolve macromolecules, CVD enables insoluble polymers to be coated and prevents solvent damage to the substrate. CVD film growth proceeds from the substrate up, allowing for interfacial engineering, real-time monitoring, and thickness control. Initiated-CVD shows successful results in terms of rationally designed micro- and nanoengineered materials to control molecular interactions at material surfaces. The success of oxidative-CVD is mainly demonstrated for the deposition of organic conducting and semiconducting polymers.

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“…The best known approach for achieving thin lm "highend" barriers of sufficient quality is by alternatingly stacking intrinsically dense inorganic (ceramic) and organic layers. The ceramic lms, of which silicon oxide, silicon nitride, and aluminum oxide are amongst the most popular materials, are applied by methods such as sputtering, 11 chemical vapour deposition, 12,13 and atomic layer deposition. 11,14,15 These metal oxide layers provide the intrinsic barrier property of the TFE stack, whereas the organic layers, which may be applied as curable formulations by printing or coating, planarize and decouple pinhole defects in subsequent inorganic layers.…”

Section: Introductionmentioning

confidence: 99%

A combined experimental and theoretical study on the side ingress of water into barrier adhesives for organic electronics applications

et al. 2014

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All hot wire chemical vapor deposition low substrate temperature transparent thin film moisture barrier

Cited by 18 publications

References 13 publications

Initiated Chemical Vapor Deposition of Polymer Films at High Process Temperature for the Fabrication of Organic/Inorganic Multilayer Thin Film Encapsulation

Initiated Chemical Vapor Deposition of Polymer Films at High Process Temperature for the Fabrication of Organic/Inorganic Multilayer Thin Film Encapsulation

25th Anniversary Article: CVD Polymers: A New Paradigm for Surface Modifi cation and Device Fabrication

A combined experimental and theoretical study on the side ingress of water into barrier adhesives for organic electronics applications

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