We present a silicon nitride/polymer hybrid multilayer moisture barrier for flexible electronics made entirely by hot wire chemical vapor deposition (HWCVD) at substrate temperatures below 100 °C. Using the initiated CVD (iCVD) variant of HWCVD for the polymer layers, these can be extremely thin, while efficiently decoupling the defects in consecutive inorganic layers. Although a single layer of low temperature SiNx is more prone to have pinholes than its state‐of‐the‐art high temperature equivalent, we have achieved a simple three‐layer structure consisting of two low‐temperature SiNx layers with a polymer layer in between, which is pinhole free and shows a water vapor transmission rate (WVTR) as low as 5 × 10–6 g/m2/day at a temperature of 60 °C and a relative humidity of 90%. This WVTR is low enough for organic devices. (© 2012 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)

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High quality non porous silicon nitride layers were deposited by hot wire chemical vapour deposition at substrate temperatures lower than 110 degrees C. The layer properties were investigated using FTIR, reflection/transmission measurements and 1:6 buffered HF etching rate. A Si-H peak position of 2180 cm(-1) in the Fourier transform infrared absorption spectrum indicates a N/Si ratio around 1.2. Together with a refractive index of 1.97 at a wavelength of 632 nm and an extinction coefficient of 0.002 at 400 nm, this suggests that a transparent high density silicon nitride material has been made below 110 degrees C, which is compatible with polymer films and is expected to have a high impermeability. To confirm the compatibility with polymer films a silicon nitride layer was deposited on poly(glycidyl methacrylate) made by initiated chemical vapour deposition, resulting in a highly transparent double layer.