Using hot wire and initiated chemical vapor deposition for gas barrier thin film encapsulation

Initiated Chemical Vapor Deposition of Polymer Films at High Process Temperature for the Fabrication of Organic/Inorganic Multilayer Thin Film Encapsulation

“…[6][7][8] These advantages of the deposition methods contributed to the fabrication of TFEs with outstanding barrier property for the encapsulation of organic electronics. [11][12][13] The barrier properties of TFE fabricated via the iCVD/ALD, iCVD/PECVD, and iCVD/HWCVD pairs were similar to each other. [11][12][13] The barrier properties of TFE fabricated via the iCVD/ALD, iCVD/PECVD, and iCVD/HWCVD pairs were similar to each other.…”

“…Especially, the unique advantages of iCVD process enabled successful fabrication of TFE, even when coupled with other inorganic layer deposition process, such as plasmaenhanced chemical vapor deposition (PECVD), [9,10] and hotwire chemical vapor deposition (HWCVD) systems. [11][12][13] The barrier properties of TFE fabricated via the iCVD/ALD, iCVD/PECVD, and iCVD/HWCVD pairs were similar to each other. However, the thickness of inorganic layer was around 100 nm for PECVD and HWCVD-deposited films, while it was 25 nm for ALD-deposited films.…”

The impact of the nano-pore filling on the performance of organosilicon-based moisture barriers

“…As a matter of fact, in our measurement configuration, a water molecule diffusing laterally through the barrier to the Ca samples should go through a path in the range of several centimeters, orders of magnitude higher than for a molecule permeating through the barrier system. 4 The defects present on the surface of the PEN substrate find their origin either in the dust contamination due to lab environment and/or antistatic particles, prior to the deposition process. The defect density can be rather scattered, as shown in Fig.…”

“…[1]. This approach has led to water vapor transmission rate (WVTR) values in the 10 −6 g m −2 day −1 regime [2][3][4], therefore suitable for the encapsulation of high-end devices, such as thin film solar cells and flexible organic light emitting diodes [5].…”

“…Coclite et al [19] reported on the deposition of multilayers based on organosilicon chemistry, in which the inorganic barrier layer is deposited by means of PE-CVD and the organic interlayer is deposited by means of initiated-CVD (i-CVD) [20][21][22]. Recently, Spee et al reported on the deposition of SiN x /poly-glycidylmethacrylate/SiN x , where the inorganic layer was deposited by hot wire chemical vapor deposition (HWCVD) and the organic layer by i-CVD [4]. The appeal of the i-CVD technique is its compatibility with vacuum systems and the full retention of the monomer chemistry, similarly to liquid phase polymerization processes [23,24].…”