All-in-One Wafer-Level Solution for MMIC Automatic Testing

Abstract

In this paper, we present an all-in-one wafer-level solution for MMIC (monolithic microwave integrated circuit) automatic testing. The OSL (open short load) two tier de-embedding, the calibration verification model, the accurate PAE (power added efficiency) testing, and the optimized vector cold source NF (noise figure) measurement techniques are integrated in this solution to improve the measurement accuracy. A dual-core topology formed by an IPC (industrial personal computer) and a VNA (vector network analyzer), and an automatic test software based on a three-level driver architecture, are applied to enhance the test efficiency. The benefit from this solution is that all the data of a MMIC can be achieved in only one contact, which shows state-of-the-art accuracy and efficiency.

A Design Method to Improve Temperature Uniformity on Wafer for Rapid Thermal Processing

“…The continuing downscaling of design features in ultra-large-scale integration (ULSI) is leading to manufacturing challenges in the semiconductor fabrication technology [1][2][3][4]. Hence, there is a need for better control of process parameters in order to meet the increasing demand.…”