2017
DOI: 10.1063/1.4978268
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All metalorganic chemical vapor phase epitaxy of p/n-GaN tunnel junction for blue light emitting diode applications

Abstract: We report on III-Nitride blue light emitting diodes (LEDs) comprising a GaN-based tunnel junction (TJ) all realized by metalorganic vapor phase epitaxy in a single growth process. The TJ grown atop the LED structures consists of a Mg-doped GaN layer and subsequently grown highly Ge-doped GaN. Long thermal annealing of 60 min at 800 °C is important to reduce the series resistance of the LEDs due to blockage of acceptor-passivating hydrogen diffusion through the n-type doped top layer. Secondary ion mass spectro… Show more

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Cited by 67 publications
(62 citation statements)
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“…This heavy Ge doping in GaN and AlGaN contributes to an increase in surface roughness, in this case of 2.5nm and 1.9nm respectively. Also, we observe the formation of V-pits in the surfaces of both the Gedoped layers related to the decoration of threading dislocations 20,34 . These pits are thicker and deeper for the the GaN TJ (average thickness of 100nm and depth of 30nm) than for the AlGaN TJ (average thickness of 52nm and depth of 2nm).…”
Section: Resultsmentioning
confidence: 81%
See 1 more Smart Citation
“…This heavy Ge doping in GaN and AlGaN contributes to an increase in surface roughness, in this case of 2.5nm and 1.9nm respectively. Also, we observe the formation of V-pits in the surfaces of both the Gedoped layers related to the decoration of threading dislocations 20,34 . These pits are thicker and deeper for the the GaN TJ (average thickness of 100nm and depth of 30nm) than for the AlGaN TJ (average thickness of 52nm and depth of 2nm).…”
Section: Resultsmentioning
confidence: 81%
“…Germanium n-doped GaN tunnel junctions on top of visible GaN LEDs were already demonstrated by Neugebauer et al 20 using an all-MOCVD growth approachnonetheless, this growth method is not optimal for tunnel junctions due to the re-passivation of the Mg acceptors by the H present in the growth chamber. A post-growth annealing to reactivate these acceptors would then be necessary, 21 but the p-doped layers in TJ devices are always buried under a highly n-doped layer, hindering the diffusion of H. [22][23][24] Additionally, for Ge-doped AlGaN layers, the Ge activation energy increases with the concentration of Al, 25 which yields a new challenge.…”
mentioning
confidence: 99%
“…The other proposal to enable the efficient hole injection from the p-type ohmic contact into the hole supplier is to utilize a tunnel junction [ 56 , 57 , 58 ]. The advantage of the tunnel junction is a direct contact between the n + -GaN layer and the metal, since the n + -GaN layer has a much higher doping efficiency than the p + -GaN layer.…”
Section: Increase the Hole Injection Efficiency From The P-type Ohmentioning
confidence: 99%
“…The depletion width of the tunnel junction was measured to be 9 nm using off‐axis electron holography, which agreed well with the simulated value of 10.7 nm. The nonabrupt p–n tunnel junction required optimization of the doping profiles and higher doping levels across the junction region …”
Section: The Off‐axis Electron Holography Schemementioning
confidence: 99%