“…Introducing a secondary metal such as B [95,165], Ag [159], Ni [119,120,135,136,157,166], In [90,115], Zn [86,109,116], La [114,167], Sn [110], Ce [85], or Mo [168] in CuPS allows the activity and stability of CuPS-cat to be enhanced because of the inhibition of Cu sintering and the presence of electron transfer between Cu and dopant. Smaller Cu crystalline and higher dispersion of Cu can be obtained by doping the promoters than those of pristine CuPS after reduction.…”