Alloying influences on low melt temperature SnZn and SnBi solder alloys for electronic interconnections

Ren, Guang; Wilding, Ian; Collins, Maurice N.

doi:10.1016/j.jallcom.2016.01.006

Cited by 113 publications

(39 citation statements)

References 64 publications

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“…Selari dengan perkembangan teknologi ke arah pengecilan bahan serta produk, maka penggunaan aloi pateri dalam bentuk pes sebagai bahan penyambung komponen elektronik kini telah mendapat perhatian yang tinggi. Pes aloi pateri ialah campuran berkrim antara serbuk aloi pateri bersama fluks dalam nisbah 50:50 (Ren et al 2016). Fluks terdiri daripada campuran resin yang berfungsi dalam aktiviti fluks, kelekitan dan sawar oksigen, bahan pengaktif bagi meningkatkan aktiviti fluks, bahan pelarut dan bahan tambahan reologi.…”

Section: Pengenalanunclassified

Kesan Pigmen Pewarna terhadap Pertumbuhan Sebatian antara Logam Sambungan Pateri Sn-3.0Ag-0.5Cu

Jalar¹,

Bakar

Ismail

et al. 2018

JSM

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Pewarnaan pes pateri membuka suatu ruang kepada keperluan dalam teknologi untuk proses pengenalpastian, penandaan, piawaian, pengujian dan penilaian terhadap antarasambungan pes pateri. Dua jenis pigmen pewarna iaitu hijau (G) dan bercahaya dalam gelap (GD) digunakan untuk mengkaji kesan pewarnaan sambungan pateri ke atas kestabilan antarasambungan pateri Sn-3.0Ag-0.5Cu (SAC 305). Pes pateri tanpa warna digunakan sebagai sampel kawalan untuk membandingkan keputusan kajian. Uji kaji penuaan sesuhu digunakan untuk melihat perubahan pertumbuhan sebatian antara logam (IMC). Pigmen pewarna GD dengan peratusan sebanyak 5% telah menunjukkan kestabilan pertumbuhan IMC dengan perubahan pertumbuhan yang paling rendah iaitu sebanyak 5.6 µm bagi sambungan pateri yang berwarna berbanding dengan peratusan pigmen pewarna yang lebih tinggi dengan perubahan pertumbuhan IMC sehingga 9 µm selepas didedahkan kepada penuaan sesuhu pada 150°C selama 1000 jam. Walau bagaimanapun, kestabilan pertumbuhan IMC dengan penggunaan pes pateri berwarna adalah lebih rendah berbanding dengan pes pateri tidak berwarna. Maka penambahan pigmen pewarna hendaklah dipertimbangkan dengan mengambil kira kestabilan mikrostruktur dan pertumbuhan lapisan IMC supaya tidak menjejaskan kualiti dan kebolehharapan sesuatu sambungan pateri.

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Section: Pengenalanunclassified

Kesan Pigmen Pewarna terhadap Pertumbuhan Sebatian antara Logam Sambungan Pateri Sn-3.0Ag-0.5Cu

Jalar¹,

Bakar

Ismail

et al. 2018

JSM

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“…Since 2006, lead-based solders have been replaced in the market because of environmental and legislation factors (Ren et al, 2016) (Collins et al, 2012). In this way, owing to its characteristics and mainly because it is a Pb-free material, the near-eutectic Sn-Ag-Cu (SAC) have been the most implemented solder alloy in electronic assemblies (Collins et al, 2016).…”

Section: Introductionmentioning

confidence: 99%

Rheology of F620 solder paste and flux

Barbosa

Teixeira

et al. 2019

SSMT

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Purpose The aim of this paper is to characterize the rheological properties of the flux media exposed to different levels of solicitation and to determine its influence on the rheology of the solder paste. The data obtained experimentally are fundamental for the development of numerical models that allow the simulation of the printing process of printed circuit boards (PCB). Design/methodology/approach Rheological tests were performed using the Malvern rheometer Bohlin CVO. These experiments consist of the analysis of the viscosity, yield stress, thixotropy, elastic and viscous properties through oscillatory tests and the capacity to recover using a creep-recovery experiment. The results obtained from this rheological analysis are compared with the rheological properties of the solder paste F620. Findings The results have shown that the flux is viscoelastic in nature and shear thinning. The viscosity does not decrease with increasing solicitations, except in the case where the flow is withdrawn directly from the bottle. Even if the solder paste shows a thixotropic behavior, this is not the case of the flux, meaning that this property is given by the metal particles. Furthermore, the oscillatory tests proved that the flux presents a dominant solid-like behavior, higher than the solder paste, meaning that the cohesive/tacky behavior of the solder paste is given by the flux. Research limitations/implications To complement this work, printing tests are required. Originality/value This work demonstrates the importance of the rheological characterization of the flux in order to understand its influence in the solder paste performance during the stencil printing process.

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“…Minor alloying elements are added in Sn-9Zn solder to enhance joint reliability. Most studies focused on the alloying effect on Sn-9Zn solder performance; additional elements can enhance the corrosion resistance, tensile strength, and wettability of Sn-9Zn solder [12][13][14][15][16][17]. Only limited attention was given to interfacial reaction in soldered joints.…”

Section: Introductionmentioning

confidence: 99%

Interfacial Reaction and Microstructure Evolution of Sn-9Zn/Ni(Cu) Solder Joints

Zhu

Peng

Wei

et al. 2019

Metals

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Sn-9Zn solder is a promising Pb-free solder, but it tends to form bulky intermetallic compounds (IMC) grains at the interface when soldered with common simple metal Cu or Ni substrates. Interfacial reaction between Sn-9Zn solder and Ni(Cu) solid solution substrates at 250 °C and 350 °C were systematically probed in this study. Results showed that when soldered at 250 °C, a Ni5Zn21 layer is formed at Sn-Zn/Ni-20Cu and Sn-Zn/Ni-40Cu joints; and Ni2Sn2Zn + Cu5Zn8 and Cu5Zn8 phases are formed in Sn-Zn/Ni-60Cu and Sn-Zn/Ni-80Cu joints, respectively. Fine-grained IMCs formed at the interface are formed even when the soldered time is prolonged to 16 h. This result indicates that Ni(Cu) solid solution substrates inhibit the rapid growth of IMC at the Sn-Zn/Ni-Cu interface. Ni(Cu) solid solution substrate can also provide various combinations of reaction products at the Sn-Zn/Ni-Cu joints. The Ni5Zn21 transfers to Ni2Sn2Zn + Cu5Zn8 phases when the Cu content increased to 60%, and a bi-layered structure Ni2Sn2Zn + Cu5Zn8 IMCs was formed in Sn-Zn/Ni(Cu) joints at 350 °C regardless of the Cu content in Ni(Cu) substrate (20–80%). These results would provide an effective support in designing Sn-Zn soldering system with optimized IMC layer to improve mechanical performance.

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Alloying influences on low melt temperature SnZn and SnBi solder alloys for electronic interconnections

Cited by 113 publications

References 64 publications

Kesan Pigmen Pewarna terhadap Pertumbuhan Sebatian antara Logam Sambungan Pateri Sn-3.0Ag-0.5Cu

Kesan Pigmen Pewarna terhadap Pertumbuhan Sebatian antara Logam Sambungan Pateri Sn-3.0Ag-0.5Cu

Rheology of F620 solder paste and flux

Interfacial Reaction and Microstructure Evolution of Sn-9Zn/Ni(Cu) Solder Joints

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