Aluminium oxide formation via atomic layer deposition using a polymer brush mediated selective infiltration approach

Snelgrove, Matthew; McFeely, Caitlin; Mani-González, P.G.; Lahtonen, Kimmo; Lundy, Ross; Hughes, Greg; Valden, M.; McGlynn, Enda; Yadav, Pravind; Saari, Jesse; Morris, Michael A.; O’Connor, Robert

doi:10.1016/j.apsusc.2020.145987

Cited by 7 publications

(9 citation statements)

References 47 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…The O 1s high-resolution X-ray photoelectron spectroscopy (HRXPS) was deconvoluted into three to four peaks as follows: Previously, P2VP films containing −OH brushes prepared by spin coating were reported to have C=O signals in O 1s XPS in the literature. 21,22 Similarly, our P2VP−AlOx film contained −OH components; therefore, it is possible that the presence of the C=O component may be related to that of −OH. The Al−OH component may originate from the low reactivity between the methyl groups and BDO.…”

Section: S2mentioning

confidence: 88%

Sequential Infiltration Synthesis with Organic Co-reactants for Extensively Swollen Organic–Inorganic Hybrid Thin Films

Kim

Jeon

2022

ACS Appl. Polym. Mater.

View full text Add to dashboard Cite

We demonstrate the growth of polymer–Al–O(−R) hybrid thin films via a sequential infiltration synthesis (SIS). SIS using an organic coreactant resulted in the expansion of the hybrid thin films with a highly uniform distribution of the chemical composition. This behavior stems from the large free volumes created by the long and flexible chains of the organic coreactant, enabling the continued incorporation of SIS precursors into the structures. The proposed method will be a valuable addition to vacuum deposition techniques for both organic–inorganic hybrid thin films and porous inorganic films with tunable porosity, pore morphology, and film thickness.

show abstract

Section: S2mentioning

confidence: 88%

Sequential Infiltration Synthesis with Organic Co-reactants for Extensively Swollen Organic–Inorganic Hybrid Thin Films

Kim

Jeon

2022

ACS Appl. Polym. Mater.

View full text Add to dashboard Cite

show abstract

“…ALD can also be used in ASD for vapour phase deposition of a metal ion into a polymer brush [ 133 ]. ASD facilitates selective blocking and activation of substrate areas.…”

Section: Bottom-up Versus Top-down Lithographymentioning

confidence: 99%

“…We can therefore conclude that DSA and ASD can create integrated architectures for metal infiltration and are an alternative inexpensive approach to sub-20 nm lithography. There are many benefits to this polymer based lithographic approach such as: no diffraction limit in resolution, directly patterned functional materials, efficiency in 3D patterning, possible improved feature control to sub 7 nm and pitch multiplication, reduction of processing steps and an innovative self-aligned patterning process with the capability to extend to 3D architectures [ 133 , 137 , 138 ]. These techniques have a predicted low cost of ownership and do not require the use of photo resists and so avoid acquisition costs such as resist spinner hotplates (estimated cost of $44,000), or deep UV photoresist stabilization systems (estimated cost of $57,000), along with their associated installation costs [ 139 ].…”

Section: Bottom-up Versus Top-down Lithographymentioning

confidence: 99%

See 1 more Smart Citation

Green Nanofabrication Opportunities in the Semiconductor Industry: A Life Cycle Perspective

Mullen

Morris

2021

Nanomaterials

View full text Add to dashboard Cite

The turn of the 21st century heralded in the semiconductor age alongside the Anthropocene epoch, characterised by the ever-increasing human impact on the environment. The ecological consequences of semiconductor chip manufacturing are the most predominant within the electronics industry. This is due to current reliance upon large amounts of solvents, acids and gases that have numerous toxicological impacts. Management and assessment of hazardous chemicals is complicated by trade secrets and continual rapid change in the electronic manufacturing process. Of the many subprocesses involved in chip manufacturing, lithographic processes are of particular concern. Current developments in bottom-up lithography, such as directed self-assembly (DSA) of block copolymers (BCPs), are being considered as a next-generation technology for semiconductor chip production. These nanofabrication techniques present a novel opportunity for improving the sustainability of lithography by reducing the number of processing steps, energy and chemical waste products involved. At present, to the extent of our knowledge, there is no published life cycle assessment (LCA) evaluating the environmental impact of new bottom-up lithography versus conventional lithographic techniques. Quantification of this impact is central to verifying whether these new nanofabrication routes can replace conventional deposition techniques in industry as a more environmentally friendly option.

show abstract

“…29,31,32 Similar to SAMs, certain polymer brushes can be used to selectively deactivate particular regions on a substrate, but as well as this, they can selectively activate based on the polymer's chemistry. 15,33,34 A polymer brush can be defined as an end grafted polymer chain bound to a surface whereby the chains stretch away from the substrate. 35,36 These polymer chains are typically covalently bonded to the surface of the substrate.…”

Section: Introductionmentioning

confidence: 99%

Rapid area deactivation for blocking atomic layer deposition processes using polystyrene brush layers

et al. 2022

View full text Add to dashboard Cite

show abstract

Aluminium oxide formation via atomic layer deposition using a polymer brush mediated selective infiltration approach

Cited by 7 publications

References 47 publications

Sequential Infiltration Synthesis with Organic Co-reactants for Extensively Swollen Organic–Inorganic Hybrid Thin Films

Sequential Infiltration Synthesis with Organic Co-reactants for Extensively Swollen Organic–Inorganic Hybrid Thin Films

Green Nanofabrication Opportunities in the Semiconductor Industry: A Life Cycle Perspective

Rapid area deactivation for blocking atomic layer deposition processes using polystyrene brush layers

Contact Info

Product

Resources

About