Aluminum Nitride Ceramic Substrates-Bonded Vertical Light-Emitting Diodes

Jeong, Tak; Kim, Kang Ho; Lee, Seung-Jae; Lee, Sang Hern; Jeon, Seong Ran; Lim, S.H.; Baek, Jong Hyeob; Lee, J.K.

doi:10.1109/lpt.2009.2020061

Cited by 20 publications

(6 citation statements)

References 17 publications

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“…Finally, for the p-type electrodes, Ti/Au (100/1000 nm) layers were deposited onto the backside of the metal receptor wafer. 16 For comparison, VLEDs with conventional n-type Cr/Au (20/800 nm) electrodes and with/without a BCBL layer were also fabricated using the same fabrication procedure. All of the samples described herein were cut into chips and packaged with high-power packages employing the same configuration of package components.…”

Section: Methodsmentioning

confidence: 99%

High-Performance Vertical Light-Emitting Diodes with Buried Current Blocking Layer and Non-Alloyed Reflective Cr/Al/Pt/Au n-type Electrodes

Jeong

Kim

Lee

et al. 2011

J. Electrochem. Soc.

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A GaN-based vertical light-emitting diode (VLED) with a novel structure, consisting of a buried current blocking layer (BCBL) inserted in p-type GaN and non-alloyed reflective n-type electrodes (Cr/Al/Pt/Au) on N-face n-GaN, is proposed and its enhanced light extraction efficiency is demonstrated. It was found that this new VLED structure could significantly increase the light output power by about 16% compared to that of the conventional VLED chips with n-type Cr/Au electrodes and without the BCBL, although the use of the BCBL slightly increased the forward voltage. The increase in the light output power was attributed to the injection of a large current density within the emission region of the active layers by the BCBL and, thus, the reduction of the optical absorption beneath the n-pad electrodes by the Cr/Al/Pt/Au metals.

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Section: Methodsmentioning

confidence: 99%

High-Performance Vertical Light-Emitting Diodes with Buried Current Blocking Layer and Non-Alloyed Reflective Cr/Al/Pt/Au n-type Electrodes

Jeong

Kim

Lee

et al. 2011

J. Electrochem. Soc.

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“…Nowadays the keen interest of scientists is concentrated in the nanoparticle industry, connected with materials combustion [1]. Particularly, aluminum-based materials obtained by high-temperature combustion of nanopowders in air offer a number of interesting and potentially high impact commercial opportunities [1][2][3][4][5][6][7][8][9]. Combustion of aluminum and iron nanopowders and their mixtures proceeds at temperatures above 2000 • C and is accompanied by a bright gloving and the scattering of combustion products in some cases [10,11].…”

Section: Introductionmentioning

confidence: 99%

Laser Systems for Distant Monitoring of Nanopowder Combustion

Li¹,

Antipov²,

Mostovshchikov³

et al. 2019

PIER M

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The paper discusses the application of laser illumination and brightness amplification techniques for studying the process of high-temperature combustion of aluminum and iron nanopowders and their mixtures. The laser equipment for visualization based on solid-state laser illuminator, brightness amplifier on copper bromide vapors and high-speed camera is considered. These approaches allow the increase of monitoring distance to 50 cm, which is important for high-temperature processes imaging. The video images allow studying the surface morphology changes during high-temperature combustion identifying the main stages of combustion, spreading of the heat waves and cooling.

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“…Management of heat transfer in powerful LED systems in most existing studies focus on heat dissipation through MCPCB (Metal Core Printed Circuit Board) and IMS (Insulated Metal Substrate) to improve the heat transfer in the design [2], [3], [4].…”

Section: Introductionmentioning

confidence: 99%

Thermal Design of LED by DOE

Vakrilov¹,

Stoynova²

2015

ELELIJ

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The article analyses the influence of the design parameters of the structure of the heat sink with round pins on the junction temperature of the LED system. The study uses design of experiment (DOE) and thermal simulations to determine the factors that have the greatest impact to improve the cooling capacity and finding the optimal heat sink design. The results of thermal design and simulation of the LED system have been validated experimentally using a thermocouple and they show that the error between the experimentally measured and simulated temperature value of optimized heat sink structure is below 6%.

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Aluminum Nitride Ceramic Substrates-Bonded Vertical Light-Emitting Diodes

Cited by 20 publications

References 17 publications

High-Performance Vertical Light-Emitting Diodes with Buried Current Blocking Layer and Non-Alloyed Reflective Cr/Al/Pt/Au n-type Electrodes

High-Performance Vertical Light-Emitting Diodes with Buried Current Blocking Layer and Non-Alloyed Reflective Cr/Al/Pt/Au n-type Electrodes

Laser Systems for Distant Monitoring of Nanopowder Combustion

Thermal Design of LED by DOE

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