Aluminum to copper thermal compression bonding for heterogeneous integration of legacy dielets

Sahoo, Krutikesh; Harish, Vineeth; Liu, Jui-Han; Irwin, Randall; Yang, Cheng-Ting Michael; Sun, Henry; Iyer, Subramanian S.

doi:10.1109/ectc51529.2024.00329

2024 IEEE 74th Electronic Components and Technology Conference (ECTC) 2024

DOI: 10.1109/ectc51529.2024.00329

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Aluminum to copper thermal compression bonding for heterogeneous integration of legacy dielets

Krutikesh Sahoo,

Vineeth Harish,

Jui-Han Liu

et al.

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Cited by 1 publication

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Fine Pitch (≤ 10μm) Die to Wafer Cu-Cu TCB on Organic Polymer Build Up Films

Harish,

Sahoo,

Zheng

et al. 2024

2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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Fine Pitch (≤ 10μm) Die to Wafer Cu-Cu TCB on Organic Polymer Build Up Films

Harish,

Sahoo,

Zheng

et al. 2024

2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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Aluminum to copper thermal compression bonding for heterogeneous integration of legacy dielets

Cited by 1 publication

References 13 publications

Fine Pitch (≤ 10μm) Die to Wafer Cu-Cu TCB on Organic Polymer Build Up Films

Fine Pitch (≤ 10μm) Die to Wafer Cu-Cu TCB on Organic Polymer Build Up Films

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