In this work, the effect on the amorphization process of the simultaneous electronic (S e ) and nuclear (S n ) energy deposition occurring upon dual-beam irradiation experiments was studied in both bulk Si single crystals (Si-b) and epitaxial Si thin layers (Si-tl). For this purpose, 900 keV I (for S n ) and 27 MeV Fe (for S e ) ions were used at different fluences in order to get complete disordering kinetics. These later were determined through the monitoring of both the disorder fraction, obtained via Rutherford backscattering spectrometry in channeling experiments and the elastic strain derived from X-ray diffraction measurements. Raman 2D-maps were also recorded to support the results of the two other techniques. RBS/C data indicate that S n irradiation alone leads to full amorphization of the irradiated region in both Si-b and Si-tl at a fluence of 1.5x10 14 cm -2 . In contrast, during the dual-beam irradiation (S n &S e ), such a complete phase transformation is prevented up to a fluence of 3x10 14 cm -2 . Similarly, the maximum elastic strain developing before the loss of crystallinity reaches a maximum of ~1 % at 1.5x10 14 cm -2 , but it remains below 0.2 % at the same fluence in the S n &S e regime for which full amorphization is not detected. These results indicate that the electronic energy deposition induces a significant dynamic annealing of the damage created by the nuclear energy-loss, and this annealing occurs over the entire investigated fluence range (i.e. up to 3x10 14 cm -2 ). The annealing efficiency is shown to be lower for Si-tl, as demonstrated by the disorder and strain values that are always larger than for the bulk counterpart.