Amorphous Ni–Mo–P diffusion barrier deposited by non-isothermal deposition

Cu/Ni/Au multilayers by electrochemistry: A crucial system in electronics - A critical review

“…Nonetheless, all of these alloys have crystalline structures. They have crystalline defects like grain boundaries that act as short-circuit diffusion paths [28,128]. , and a good corrosion resistance [124].…”

“…Ni-Mo-P films keep their amorphous structure. Therefore, Ni-Mo-P films have higher electrical conductivity since Mo is a better electrical conducive material and P has an electrical scattering effect [121,128]. Such coatings offer an interesting combination of high corrosion resistance [104,113,116,161], and high hardness and wear resistance [104,108,109,111,161].…”

“…Therefore, the electrochemical deposition of Nirefractory metal alloys has gained a lot of interest. Note that refractory metals can be only incorporated inside the growing Ni films, which is known as induced co-deposition[128].Sodium tungstate (for Ni-W) or sodium molybdate (for Ni-Mo) are usually added instead of sulfate or chloride salts as source of refractory metals. Given the fundamental similarities of refractory metals, this part is focused only on Ni-Mo films.…”

Thermal Stability, Hardness, and Corrosion Behavior of the Nickel–Ruthenium–Phosphorus Sputtering Coatings

“…However, the low crystallization temperature of approximately 350 • C of the Ni-P coatings is critical for high-temperature applications and further fields of use [7]. The introduction of the third elements and compounds, including Al [8], Cr [9], Mo [10], Cu [11][12][13], Al 2 O 3 [14,15], CNTs [16,17], etc., are frequently proposed to further enhance its mechanical, thermal, and chemical properties. For instance, the thermal stability of the Ni-P layer could be improved by the introduction of a third element with high melting point like W [18,19].…”

Fabrication of a hydrophobic, electromagnetic interference shielding and corrosion-resistant wood composite via deposition with Ni–Mo–P alloy coating

“…Amani et al 17 veried that the Ni-Mo-P coatings showed a higher corrosion resistance compared with Ni-P lms. Wu et al 18 and Chou et al 19 demonstrated that an increase in Mo content in Ni-Mo-P deposits decreased the electrical resistivity because the coating crystallinity increased. To date, Ni-Mo-P ternary alloys have been plated successfully on many substrates, including alumina ceramic, copper and mild steel panels.…”