2005
DOI: 10.1109/tia.2004.840948
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<tex>$hboxCF _4$</tex>Decomposition Using Inductively Coupled Plasma: Effect of Power Frequency

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Cited by 23 publications
(12 citation statements)
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“…If in the first step reactions (1)-(6) have not occurred availability, there is not enough CF i produced. So there is no CO 2 and F produced in the later reactions (9)-(13), although more O radicals produced in reaction (8) with the increase of O 2 concentration. The result indicated that CF 4 decomposition highly depended on the electron collision as described in reactions (1)- (6).…”
Section: Effect Of O 2 Concentration On Dre Of Cfmentioning
confidence: 98%
See 1 more Smart Citation
“…If in the first step reactions (1)-(6) have not occurred availability, there is not enough CF i produced. So there is no CO 2 and F produced in the later reactions (9)-(13), although more O radicals produced in reaction (8) with the increase of O 2 concentration. The result indicated that CF 4 decomposition highly depended on the electron collision as described in reactions (1)- (6).…”
Section: Effect Of O 2 Concentration On Dre Of Cfmentioning
confidence: 98%
“…Recently, the plasma technologies used in the abatement of perfluorocompounds include dielectric barrier discharges, inductively coupled plasma and microwave plasma [5][6][7][8][9][10][11][12][13][14][15]. Microwave plasma has high electron temperature and high electron density which is more efficient to perfluorocompounds abatement than other plasma technology.…”
Section: Introductionmentioning
confidence: 99%
“…Recently, efforts have been made to abate the organic pollutants using either thermal or nonthermal plasma processes [1][2][3][4][5]. Thermal plasma processes such as DC arc, microwave discharge, and inductively coupled plasma are often used for treating high organic concentration streams, but not suitable for gas streams containing low concentrations of organic compounds because they necessarily consume a lot of electrical energy.…”
Section: Introductionmentioning
confidence: 99%
“…To prevent further global warming, the semicon- ductor industry is committed to reducing the emission of PFCs to 10% below the emission level of 1995 by 2010 [2]. Thus, many developments of PFC emissions reduction have been performed in four general areas: process optimization, alternative chemistries, capture/recovery, and abatement [3]- [14].…”
Section: Introductionmentioning
confidence: 99%