An alternative thermal approach to evaluate the wettability of solder alloys

Santos, Washington Luis Reis; Silva, Bismarck Luiz; Bertelli, Felipe; Spinelli, José Eduardo; Cheung, Noé; Garcia, Amauri

doi:10.1016/j.applthermaleng.2016.06.177

Cited by 19 publications

(11 citation statements)

References 38 publications

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“…Solidification interval and melt fluidity are considered key factors in altering thermal conductance at the metal/mold interface [27,28]. These factors influence the thermal history during solidification.…”

Section: Resultsmentioning

confidence: 99%

Relationship Between Microstructure Evolution and Tensile Properties of AlSi10mg Alloys With Varying Solidification Cooling Rates

Gandolfi¹,

Mg²,

Lf³

et al. 2021

Preprint

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This work explored and contrasted the effect of microstructure on the tensile properties of AlSi10Mg alloys generated by transient directional solidification depending on variations in cooling rate and Magnesium (Mg) content (i.e., 0.45 and 1wt.% Mg), with a focus on understanding the dendritic growth and phases constitution. Optical and Scanning electron (SEM) microscopies, CALPHAD and thermal analysis were used to describe the microstructure, forming phases and resulting tensile properties. The findings showed that the experimental evolution of the primary dendritic spacing is very similar when both directionally solidified (DS) Al-10wt.% Si-0.45wt.% Mg and Al-10wt.% Si-1wt.% Mg alloys samples are compared. The secondary dendritic spacing was lower for the alloy with more Mg, especially considering the range of high growth velocities. Moreover, a greater fraction of (Al+Si+Mg2Si) ternary eutectic islands surrounding the -Al dendritic matrix was noted for the alloy with 1wt.% Mg. As a result of primary dendritic spacings greater than 180 m related to lower cooling rates, slightly higher tensile properties were attained for the Al-10wt.% Si-0.45wt.% Mg alloy. In contrast, combining dendritic refining (< 150 m) and larger Mg2Si fraction, fast solidified DS Al-10wt.% Si-1wt.% Mg samples exhibited higher tensile strength and elongation. The control of cooling rate and fineness of the dendritic array provided a new insight related to the addition of Mg in slightly higher levels than conventional ones, capable of achieving a better balance of tensile properties in AlSi10Mg alloys.

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Section: Resultsmentioning

confidence: 99%

Relationship Between Microstructure Evolution and Tensile Properties of AlSi10mg Alloys With Varying Solidification Cooling Rates

Gandolfi¹,

Mg²,

Lf³

et al. 2021

Preprint

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“…Even though previous works demonstrated that the initial wetting stages are used to be correlated with heat transfer capability between eutectic forming alloys and substrate [22,23], it does not appear to be possible to use such approach here. The correlation between solder/ substrate heat transfer coefficient, h OV (as determined in the last section) and the wetting of the couple is very weak.…”

Section: Wetting Behavior Of the Tested Couplesmentioning

confidence: 99%

“…Previous researches demonstrated that quantitative wetting data (wetting angles values-θ) may be related to the heat flux within the alloy/substrate pair, with heat flux being represented by a global heat transfer coefficient-h g . θ values/ h g /thermal parameters interrelations for LFSA have been determined and reported in the literature for: Zn-Sn [22], Sn-Cu [18,23] and Bi-Ag solder alloys [19].…”

Section: Introductionmentioning

confidence: 99%

The application of an analytical model to solve an inverse heat conduction problem: Transient solidification of a Sn-Sb peritectic solder alloy on distinct substrates

Curtulo

Dias

Bertelli

et al. 2019

Journal of Manufacturing Processes

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“…The procedure proposed by Santos et al and Silva et al [19][20][21] was implemented in order to assess the contact angle results. Two different periods of time across the experimental data are considered as of prime importance.…”

Section: Experiments Following Interfacial Reactionsmentioning

confidence: 99%

Sn-Bi(-Ga) TIM Alloys: Microstructure, Tensile Properties, Wettability and Interfacial Reactions

Silva

Gouveia

Reyes

et al. 2019

Journal of Elec Materi

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In the present study, the main purpose is to examine the quality of the interface formed between either binary Sn-Bi or ternary Sn-Bi-2wt.%Ga Thermal Interface Material-TIM alloys and a copper (Cu) substrate. The characteristics of the formed intermetallic compound (IMC) films were analyzed in the as-soldered joints, as well as during isothermal heat treatments at 100°C for long periods of time. Thermo-Calc computations were also used in return for a better comprehension of the mechanisms involved, including, for instance, those related to the presence of Ga within the interdendritic regions. This can be explained by the increase in the Ga-amount in the liquid-phase with the progress of solidification. In an effort to address the wettability issue, the contact angles between the molten alloy and the Cu substrate were also determined. Finally, tensile tests were performed in order to evaluate the effects of the minor Ga additions in the alloy's overall mechanical properties. Despite unsound alloy mechanical properties, gallium (Ga) additions effectively suppress the formation of the CuSn intermetallic by replacing it with a Cu 9 Ga 4 IMC layer in the as-soldered material, which grew with less deleterious morphology and finer thicknesses.

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An alternative thermal approach to evaluate the wettability of solder alloys

Cited by 19 publications

References 38 publications

Relationship Between Microstructure Evolution and Tensile Properties of AlSi10mg Alloys With Varying Solidification Cooling Rates

Relationship Between Microstructure Evolution and Tensile Properties of AlSi10mg Alloys With Varying Solidification Cooling Rates

The application of an analytical model to solve an inverse heat conduction problem: Transient solidification of a Sn-Sb peritectic solder alloy on distinct substrates

Sn-Bi(-Ga) TIM Alloys: Microstructure, Tensile Properties, Wettability and Interfacial Reactions

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