A crystalline
beryllium oxide (BeO) film was grown on 4H-silicon carbide (4H-SiC)
via thermal atomic layer deposition (ALD). Diethylberyllium and water
were used as key precursors. The growth rate of BeO corresponded to
0.8 Å/cycle over the temperature range of 150–200 °C.
Transmission electron microscopy and X-ray diffraction of BeO/4H-SiC
demonstrated that wurtzite BeO (0002) was grown on 4H-SiC (0001) substrate.
The average crystallite sizes of BeO were 15–16 nm, and the
compressive strain was applied to the BeO film in the out-of-plane
direction. The band alignment and interface defects of BeO/4H-SiC
were determined by using internal photoemission spectroscopy (IPE),
ultraviolet photoelectron spectroscopy (UPS), and reflection electron
energy loss spectroscopy (REELS). The conduction band offset (CBO),
valence band offset (VBO), and energy bandgap of 4H-SiC and BeO corresponded
to 2.28 ± 0.1 eV, 2.53 ± 0.01 eV, 3.16 ± 0.1 eV, and
8.3 ± 0.05 eV, respectively. The calculated bandgap (7.97 eV)
of a thin BeO film was obtained from the sum of CBO (2.28 eV), VBO
(2.53 eV), and the SiC bandgap (3.16 eV). The difference between the
calculated (7.97 eV) and REELS (8.3 eV) bandgaps of BeO film is due
to the error bars between the analysis methods. Interface defect levels,
as determined via IPE analysis, corresponded to 3.53 ± 0.1 eV
(graphitic carbon) and 4.46 ± 0.1 eV (π-bonded carbon)
and were formed during the ohmic annealing process.